Forums

There are a total of six Forums this year on six different topics.  In each Advanced-Circuit-Design Forum, selected through a competitive process within each subcommittee of the ISSCC, leading experts present state-of-the-art design strategies. The Forums are targeted at designers experienced in the technical field. The registration offers a bundle to attend all Forums in person, a bundle to attend in person all Forums on Sunday or on Thursday, and a bundle to access all Forums only on-demand. The in-person bundles will enable also on-demand access to the same content chosen for live attendance.

  • Next-Generation AI and HPC Through Memory, Interconnect, Power, and Architecture Co-Design

  • Data Converters at the Bottleneck: Scaling ADC/DAC Design for 448G–3.2T Wireline Links

  • Emerging Electrical and Optical Connectivity: From System Architecture to Circuits

  • AI Optimized Sensing: Approaching Physical World Through Co-Designed Sensors and AI

  • Towards 6G: Circuits and Systems for Joint Communication, Sensing, and Edge AI

  • Enabling the Quantum Revolution: Silicon Systems for High-Precision Quantum Sensing and Computing

Download the 2027 ISSCC Advance Program