ISSCC Committees
2025 Executive & Regional Committees
Conference Chair
Edith Beigné
Meta, Menlo Park, CA
Past Conference Chair and AdCom Rep
Eugenio Cantatore
Eindhoven University of Technology, Eindhoven, The Netherlands
Steering Committee Chair
Anantha Chandrakasan
Massachusetts Institute of Technology, Cambridge, MA
Executive Committee Secretary
Makoto Nagata
Kobe University, Kobe, Japan
Demo Session Chair
Patrick Mercier
University of California, San Diego, La Jolla, CA
Press Coordinator
Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada
Press Liaison
Laura Fujino
University of Toronto, Toronto, Canada
Social Media Chair
Vito Gianini
Uhnder, Austin, TX
Web Site & A/V Chair
Trudy Stetzler
Houston, TX
Program Chair
Keith Bowman
Qualcomm, Raleigh, NC
Program Vice-Chair
Marian Verhelst
KU Leuven & imec, Belgium
Past Program Chair
Thomas Burd
Advanced Micro Devices, Santa Clara, CA
Industry Chair
Vivek De
Intel, Hillsboro, OR
Exhibition Chair
Eric Karl
Intel
Education Chair
Ali Sheikholeslami
University of Toronto, Toronto, Canada
SRP Chair
Jerald Yoo
Seoul National University, Seoul, Korea
WIC Representative
Farhana Sheikh
Altera, Portland, OR
Adcom Representative
Jan van der Spiegel
University of Pennsylvania, Philadelphia, PA
ITPC APAC (Asia Pacific) Regional Chair
Wei-Zen Chen
National Yang Ming Chiao Tung University, Hsinchu, Taiwan
ITPC APAC (Asia Pacific) Regional Vice-Chair
Kousuke Miyaji
Shinshu University, Nagano, Japan
ITPC EWAA (Europe, West Asia, Africa) Regional Chair
Jens Anders
University of Stuttgart, Stuttgart, Germany
ITPC EWAA (Europe, West Asia, Africa) Regional Vice-Chair
Qinwen Fan
Delft University of Technology, Delft, The Netherlands
ITPC AM (Americas) Regional Chair
Danielle Grifith
Texas Instruments, Dallas, TX
ITPC AM (Americas) Regional Vice-Chair
Jacques "Chris" Rudell
University of Washington, Seattle, WA
Director of Publications
Laura Fujino
University of Toronto, Toronto, Canada
Director of Operations
Melissa Widerkehr
Widerkehr and Associates, Lewes, DE
Plenary Selection Committee
Plenary Chair
Anantha Chandrakasan
Massachusetts Institute of Technology, Cambridge, MA
Plenary Co-Chair
Keith Bowman
Qualcomm, Raleigh, NC
ITPC AM (Americas) Regional Chair
Danielle Grifith
Texas Instruments, Dallas, TX
Member
Marian Verhelst
KU Leuven & imec, Belgium
Member
Thomas Burd
Advanced Micro Devices, Santa Clara, CA
Member
Laura Fujino
University of Toronto, Toronto, Canada
ITPC APAC (Asia Pacific) Regional Chair
Wei-Zen Chen
National Yang Ming Chiao Tung University, Hsinchu, Taiwan
ITPC EWAA (Europe, West Asia, Africa) Regional Chair
Jens Anders
University of Stuttgart, Stuttgart, Germany
Member
Edith Beigné
Meta, Menlo Park, CA
EWAA (Europe, West Asia, Africa) Regional Subcommittee
ITPC EWAA (Europe, West Asia, Africa) Regional Chair
Jens Anders
University of Stuttgart, Stuttgart, Germany
ITPC EWAA (Europe, West Asia, Africa) Regional Vice-Chair
Qinwen Fan
Delft University of Technology, Delft, The Netherlands
ITPC EWAA (Europe, West Asia, Africa) Regional Secretary
Frank Prämssing
Infineon Technologies Austria AG, Villach, Austria
Patrik Arno
ST Microelectronics, Sassenage, France
Masoud Babaie
Delft University of Technology, Delft, The Netherlands
Harijot Singh Bindra
University of Twente, Eindhoven, The Netherlands,
Jan Bogaerts
Gpixel, Antwerpen, Belgium,
Edoardo Bonizzoni
University of Pavia, Pavia, Italy
Lucien Breems
NXP Semiconductors, Eindhoven, The Netherlands
Dmytro Cherniak
Infineon Technologies, Villach, Austria
Sylvain Clerc
ST Microelectronics, Crolles Cedex, France
Francesco Conti
University of Bologna, Bologna, Italy
Giuseppe Desoli
STMicroelectronics S.p.A. Italy, Cornaredo, Italy
Sijun Du
Delft University of Technology, Delft, The Netherlands
Giorgio Ferrari
Politecnico di Milano, Milano, Italy
Pasqualina Fragneto
STMicroelectronics, Brianza, Italy
Leonardo Gasparini
Fondazione Bruno Kessler, Trento, Italy
Jose Luis Gonzalez-Jimenez
CEA-Leti, Grenoble, France
Giuseppe Gramegna
imec, Leuven, Belgium
Pieter Harpe
Eindhoven University of Technology, Eindhoven, The Netherlands
Thomas Hein
Micron, Munich, Germany
Taekwang Jang
ETH Zurich, Zurich, Switzerland
Gunther Lehmann
Infineon Technologies AG, Neubiberg, Germany
Konstantinos Manetakis
CSEM, Neuchâtel, Switzerland
Danilo Manstretta
University of Pavia, Pavia, Italy
Ewout Martens
imec, Leuven, Belgium
Carolina Mora-Lopez
imec, Leuven, Belgium
Filippo Neri
Renesas Design Zürich AG, Zürich, Switzerland
Peter Ossieur
Imec, Univ. Ghent, Ghent, Belgium
Michiel Pertijs
Delft University of Technology, Delft, The Netherlands
Tim Piessens
KU-Leuven ESAT-MICAS, Leuven, Belgium
Luigi Pilolli
Openchip & Software Technologies, Roma, Italy
Thomas Poeppelmann
Infineon Technologies, Neubiberg, Germany
Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom
Joachim Rodrigues
Lund University, Lund, Sweden
Viola Schaffer
Texas Instruments, Freising, Germany
Fabio Sebastiano
Delft University of Technology, Delft, The Netherlands
Mina Shahmohammadi
NXP Semiconductors, Delft, The Netherlands
Mahsa Shoaran
EPFL, Geneva, Switzerland
Teerachot Siriburanon
University College Dublin, Dublin, Ireland
Henrik Sjöland
Lund University & Ericsson, Lund, Sweden
Thomas Toifl
Cisco Systems, Thalwil, Switzerland
Guy Torfs
Ghent University, Ghent, Belgium
Mikko Varonen
VTT Technical Research Centre of Finland Ltd, Espoo, Finland
Caspar van Vroonhoven
Analog Devices, Ismaning, Germany
Jan Westra
Broadcom, Bunnik, The Netherlands
Bernhard Wicht
University of Hannover, Hannover, Germany
APAC (Asia Pacific) Regional Subcommittee
ITPC APAC (Asia Pacific) Regional Chair
Wei-Zen Chen
National Yang Ming Chiao Tung University, Hsinchu, Taiwan
ITPC APAC (Asia Pacific) Regional Vice-Chair
Kousuke Miyaji
Shinshu University, Nagano, Japan
ITPC APAC (Asia Pacific) Regional Secretary
Jun Yin
University of Macau, Macau, China
Ippei Akita
AIST, Tsukuba, Japan
Utsav Banerjee
Indian Institute of Science, Bengaluru, India
Chi-Hang (Ivor) Chan
University of Macau, Macau, China
Lin Cheng
University of Science and Technology of China, Hefei, China
Wooyeol Choi
Seoul National University, Seoul , Korea
Mei-Chen Chuang
TSMC, Hsinchu, Taiwan
Juang-Ying Chueh
Etron Technology, Taipei, Taiwan
Chunmeng Dou
Chinese Academy of Sciences (CAS), Beijing, China
Eric Jia-Wei Fang
MediaTek, Hsinchu City, Taiwan
Kazuki Fukuoka
Renesas Electronics, Tokyo, Japan
Hao Gao
Southeast University, Nanjing, China
Xiang Gao
Zhejiang University, Zhejiang, China
Yuan Gao
Southern University of Science and Technology School of Microelectronics, Shenzhen, China
Jianping Guo
Sun Yat-sen University School of Electronics and Information Technology, Guangzhou, China
Hiroshi Hamada
NTT, Kanagawa, Japan
Mutsumi Hamaguchi
Sharp Corporation, Nara, Japan
Chen-Yen Ho
MediaTek, Hsinchu, Taiwan
Sung-Wan Hong
Sogang University, Seoul, Korea
Chuan-Hung Hsiao
MediaTek, Hsinchu City, Taiwan
Kenny Hsieh
TSMC, Hsinchu, Taiwan
Ping‐Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan
Yu-Li Hsueh
Mediatek Inc, Hsinchu, Taiwan
Vita Pi-Ho Hu
National Taiwan University, Taipei, Taiwan
Mo Huang
University of Macau, Macao, China
Chih-Ming Hung
MediaTek, Taipei, Taiwan
Koji Inoue
Kyushu University, Fukuoka, Japan
Takashi Ito
Renesas, Tokyo, Japan
Minkyu Je
KAIST, Daejeon, Korea
Dongsuk Jeon
Seoul National University, Seoul , Korea
Shusuke Kawai
Toshiba, Kawasaki, Japan
Xugang Ke
Zhejiang University, Zhejiang, China
Bongjin Kim
KAIST, Daejeon, Korea
Dongkyun Kim
SK hynix, Icheon, Korea
Dongsu Kim
Samsung Electronics, Hwaseong, Korea
Hye-Ran Kim
Samsung Electronics, Anyang, Korea
Hyun-Sik Kim
KAIST, Daejeon, Korea
Ji-Hoon Kim
Hanyang University, Seoul, Korea
Wan Kim
Samsung Electronics, Hwaseong, Korea
Seunghoon Ko
Kwangwoon University, Seoul, Korea
Kyeongha Kwon
KAIST, Daejeon, Korea
Hyung-Min Lee
Korea University, Seoul, Korea
Yong Ki Lee
Samsung Electronics, Suwon, Korea
Ka-Meng Lei
University of Macau, Macau
Xueqing Li
Tsinghua University, Beijing, China
Yu-Te Liao
National Yang Ming Chiao Tung University, Hsinchu City, Taiwan
Chin-Yu Lin
Mediatek, Hsinchu City, Taiwan
Leibo Liu
Tsinghua University, Beijing, China
Xun Liu
The Chinese University of Hong Kong, Shenzhen, China
Noriyuki Miura
Osaka University, Osaka, Japan
Sugako Otani
Renesas Electronics, Tokyo, Japan
Quan Pan
Southern University of Science and Technology (SUSTech), Shenzhen, China
Hyun-Chul Park
Samsung (KR), Hwaseong, Korea
Jun-Seok Park
S.LSI, Samsung Electronics, Hwaseong, Korea
Shanthi Pavan
IIT Madras, Chennai, India
Rahul Rao
IBM India, Bangalore, India
Ben Rhew
Samsung, Hwaseong, Korea
Jiayoon Ru
Peking University, Beijing, China
Seung-Tak Ryu
KAIST, Daejeon, Korea
Soojung Ryu
Seoul National University, Seoul, Korea
Masaki Sakakibara
Sony Semiconductor Solutions Corporation, Atsugi, Japan
Min-Woong Seo
Samsung Electronics Semiconductor R&D Center (SRDC), Hwaseong, Korea
Shyh-Shyuan Sheu
ITRI, Hsinchu, Taiwan
Hidehiro Shiga
KIOXIA, Yokohama, Japan
Atsuhi Shirane
Institute of Science, Tokyo, Japan
Sanshiro Shishido
Panasonic Holdings Corporation, Osaka, Japan
Minyoung Song
DGIST, Daegu, Korea
Takeshi Sugawara
The University of Electro-Communications, Tokyo, Japan
Xiyuan Tang
Peking University, Beijing, China
Pei-Yun Tsai
National Taiwan University, Taipei, Taiwan
Bo (Angela) Wang
Singapore University, Singapore
Eric Wang
TSMC, Hsinchu, Taiwan
Yun Wang
Fudan University, Shanghai, China
Zhiwei Xu
Zhejing University, Zhejing, China
Masanao Yamaoka
Hitachi, Tokyo, Japan
Jun Yang
Southeast University, Nanjing, China
Il-Min Yi
Gwangju Institute of Science and Technology, Gwangju, Korea
Yun Yin
Fudan University, Shanghai, China
Heein Yoon
Ulsan National Institute of Science and Technology, Ulsan, Korea
Yihan Zhang
Hong Kong University of Science and Technology (HKUST), Kowloon, Hong Kong
Bo Zhao
Zhejing University, Zhejing, China
Yuanjin Zheng
School of Electrical and Electronic Engineering Nanyang Technological Univ., Singapore
Jun Zhou
University of Electronic Science and Technology of China, Chengdu, China
AM (Americas) Regional Subcommittee
ITPC AM (Americas) Regional Secretary
Carlos Tokunaga
Intel, Hillsboro, OR
ITPC AM (Americas) Regional Chair
Danielle Grifith
Texas Instruments, Dallas, TX
ITPC AM (Americas) Regional Vice-Chair
Jacques "Chris" Rudell
University of Washington, Seattle, WA
Hajime Shibata
Analog Devices, Toronto, Canada
Mahmut Ersin Sinangil
Nvidia, Santa Clara, CA
Shiyu Su
University of Waterloo, Waterloo, Canada
Andreas Suess
Google, Mountain View, CA
Julian Tham
Infineon, San Jose, CA
Kaushik Vaidyanathan
OpenAI, San Francisco, CA
Alberto Valdes-Garcia
IBM Research, Yorktown Heights, NY
Srividhya Venkataraman
AMD, Santa Clara, CA
Albert Wang
Apple, Cupertino, CA,
Paul Whatmough
Qualcomm, Boston, MA
Amy Whitcombe
Intel, Santa Clara, CA
John Wuu
Advanced Micro Devices, Fort Collins, CO
Augusto Ximenes
CogniSea, Inc., Seattle, WA
Dihang Yang
Broadcom, Irvine, CA
Kaiyuan Yang
Rice University, Houston, TX
Alfred Yeung
AMD, Santa Clara, CA
Xin Zhang
IBM T. J. Watson Research Center, Yorktown Heights, NY
Zhengya Zhang
University of Michigan, Ann Arbor, MI
Alireza Zolfaghari
Broadcom, Irvine, CA
Firooz Aflatouni
University of Pennsylvania, Philadelphia, PA
Tamer Ali
Mediatek, Irvine, CA
Sally Amin
Apple, Cupertino, CA
Mark A. Anders
Intel, Hillsboro, OR
Alyssa Apsel
Cornell University, Ithaca, NY
Uygar Avci
Intel, Hillsboro, OR
Saurav Bandyopadhyay
Texas Instruments, Dallas, TX
Joseph Bardin
Google & UMass Amherst, Goleta, CA
Nicolas Butzen
Intel, Hillsboro, OR
Sudipto Chakraborty
IBM T. J. Watson Research Center, Plano, TX
Vanessa Chen
Carnegie Mellon University, Pittsburgh, PA
Wu-Hsin Chen
Qualcomm, San Diego, CA
Taiyun Chi
Rice University, Houston, TX
SungWon Chung
Neuralink, Fremont, CA
Zeynep Toprak Deniz
IBM Research, Yorktown Heights, NY
Jeremy Dunworth
Qualcomm Technologies Inc., San Diego, CA
Azita Emami
California Institute of Technology (Caltech), Pasadena, CA
Chinwuba Ezekwe
Robert Bosch, Sunnyvale, CA
Santosh Ghosh
Nvidia, Hillsboro, OR
Huichu Liu
Meta Platforms, Sunnyvale, CA
Ping Lu
Microsoft, Redmond, WA
Nima Maghari
University of Florida, Gainesville, FL
Didem Turker Melek
Cadence Design Systems, San Jose, CA
Alyosha Molnar
Cornell University, Ithaca, NY
Omeed Momeni
UC Davis, Davis, CA
Daniel H. Morris
OpenAI, San Francisco, CA
Ahmed Mostafa
Marvell, Santa Clara, CA
Rikky Muller
University of California, Berkeley, Berkeley, CA
Shahrzad Naraghi
Anaflash, Sunnyvale, CA
Nathaniel Pinckney
Nvidia, Austin, TX
Raja Pullela
Maxlinear
Priyanka Raina
Stanford University, Stanford, CA
Negar Reiskarimian
Massachusetts Institute of Technology (MIT), Cambridge, MA
Joseph (Joey) Sankman
Analog Devices, Fort Collins, CO
Visvesh Sathe
Georgia Institute of Technology, Atlanta, GA
Shreyas Sen
Purdue University, West Lafayette, IN
Kaushik Sengupta
Princeton University, Princeton, NJ
Jae-sun Seo
Cornell Tech, New York, NY
Shahriar Shahramian
Nokia – Bell Labs, New Providence, NJ
Brian Ginsburg
Texas Instruments, Dallas, TX
Venugopal Gopinathan
Analog Devices, Wilmington, MA
Jie Gu
Northwestern University, Evanston, IL
Zheng Guo
Intel, Portland, OR
Sumanth Gururajarao
MediaTek, Austin, TX
Drew Hall
University of California at San Diego, La Jolla, CA
Ruonan Han
MIT, Cambridge, MA
Daniel Holcomb
University of Massachusetts, Amherst, Amherst, MA
Masum Hossain
Carleton University, Ottawa, ON
Hua-Ling (Cynthia) Hsu
Sandisk, Milpitas, CA
Cheng Huang
Iowa State University, Ames, IA
Kuo-Ken Huang
Everactive, USA
Jay Im
AMD, San Jose, CA
Rinkle Jain
Nvidia, Santa Clara, CA
Xiaocheng Jing
Qualcomm, Santa Clara, CA
Chiraag Juvekar
Apple, San Carlos, CA
Monodeep Kar
IBM T. J. Watson Research Center, Yorktown Heights, NY
Jaydeep Kulkarni
The University of Texas at Austin, Austin, TX
Hanh-Phuc Le
UCSD, La Jolla, CA
Saekyu Lee
EnCharge AI, Greenwood Village, CO