Technical Committees
Technical Editors
Jason H. Anderson
University of Toronto, Toronto, Canada
Leonid Belostotski
The University of Calgary, Calgary, Canada
Dustin Dunwell
Alphawave IP, Toronto, Canada
Vincent Gaudet
University of Waterloo,Waterloo, Canada
Glenn Gulak
University of Toronto, Toronto, Canada
James W. Haslett
The University of Calgary, Calgary, Canada
Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada
Samantha Murray
StarIC, Toronto, Canada
Multi-Media Coordinator and Digest Editor
David Halupka
StarIC, Toronto, Canada
Program Chair
Marian Verhelst
KU Leuven & imec, Heverlee, Belgium
Program Vice-Chair
Stefano Pellerano
Intel, Hillsboro, OR
ITPC AM (Americas) Regional Chair
Chris Rudell
University of Washington, Seattle, WA
ITPC AM (Americas) Regional Vice-Chair
Carlos Tokunaga
Intel, Hillsboro, OR
ITPC APAC (Asia Pacific) Regional Chair
Kousuke Miyaji
Shinshu University, Nagano, Japan
ITPC APAC (Asia Pacific) Regional Vice Chair
Jun Yin
University of Macau, Macau, China
ITPC EWAA (Europe, West Asia, Africa) Regional Chair
Qinwen Fan
Delft University of Technology, Delft, The Netherlands
ITPC EWAA (Europe, West Asia, Africa) Regional Vice Chair
Frank Prämaßing
Infineon Technologies Austria AG, Villach, Austria
Analog Subcommittee
Chair: Viola Schaffer
Texas Instruments, Freising, Germany
Ippei Akita
AIST, Tsukuba, Japan
Harijot Singh Bindra
University of Twente, Enschede, The Netherlands
Edoardo Bonizzoni
University of Pavia, Pavia, Italy
Mei-Chen Chuang
TSMC, Hsinchu, Taiwan
Chinwuba Ezekwe
Robert Bosch, Sunnyvale, CA
Qinwen Fan
Delft University of Technology, Delft, The Netherlands
Chuan-Hung Hsiao
MediaTek, Hsinchu City, Taiwan
Minkyu Je
KAIST, Daejeon, Korea
Matthias Kuhl
University of Freiburg – IMTEK, Freiburg, Germany
Inhee Lee
University of Pittsburgh, Pittsburgh, PA
Ka-Meng Lei
University of Macau, Macau
Aaron Partridge
SiTime, Lakewood, WA
Tim Piessens
KU-Leuven ESAT-MICAS, Leuven, Belgium
Sam Sheng
Google, Stanford University
Caspar van Vroonhoven
Analog Devices, Ismaning, Germany
Yihan Zhang
Hong Kong University of Science and Technology (HKUST), Hong Kong
Data Converters Subcommittee
Chair: Pieter Harpe
Eindhoven University of Technology, Eindhoven, The Netherlands
Lucien J. Breems
NXP Semiconductors, Eindhoven, The Netherlands
Chi-Hang (Ivor) Chan
University of Macau, Macau, China,
Vanessa Chen
Carnegie Mellon University, Pittsburgh, PA, TX
Tetsuya Iizuka
University of Tokyo, Tokyo, Japan
Wan Kim
Samsung Electronics, Hwasung-si, Korea
Chin-Yu Lin
Mediatek, Hsinchu City, Taiwan
S. Zeynep Lulec
Marvell Technology, Inc., Toronto, Canada
Ewout Martens
imec, Leuven, Belgium
Shanthi Pavan
IIT Madras Dept of Electrical Eng., Chennai, India
Athanasios Ramkaj
AMD, San Jose, CS
Seung-Tak Ryu
KAIST, Daejeon, Korea
Hajime Shibata
Analog Devices, Toronto, Canada
Shiyu Su
University of Waterloo, Waterloo, Canada
Xiyuan Tang
Peking University, Beijing, China
Frank van der Goes
Broadcom, Bunnik, The Netherlands
Amy Whitcombe
Intel, Santa Clara, CA
Il-Min Yi
Gwangju Institute of Science and Technology, Gwangju, Korea
Digital Architectures & Systems (DAS) Subcommittee
Chair: Rahul Rao
IBM India, Bangalore, India
Mark A. Anders
Intel, Hillsboro, OR
Andreas Burg
EPFL & RAAAM Memory Technologies, Echandens, Switzerland
Francesco Conti
University of Bologna, Bologna, Italy
Giuseppe Desoli
STMicroelectronics S.p.A. Italy, Cornaredo, Italy
Sumanth Gururajarao
MediaTek, Austin, TX
Youngjoo Lee
KAIST, Daejeon, Korea
Jun-Seok Park
Seoul National University, Seoul, Korea
Nathaniel Pinckney
Nvidia, Austin, TX
Priyanka Raina
Stanford University, Stanford, CA
Soojung Ryu
Seoul National University, Seoul, Korea
Pei-Yun Tsai
National Taiwan University, Taipei, Taiwan
Srividhya Venkataraman
AMD, Santa Clara, CA
Paul Whatmough
Qualcomm, Boston, MA
Tony Wu
Metas, San Jose, CA
Zhengya Zhang
University of Michigan, Ann Arbor, MI
Jun Zhou
University of Electronic Science and Technology of China, Chengdu, China
Digital Circuits (DCT) Subcommittee
Chair: Huichu Liu
Meta Platforms, Sunnyvale, CA
Sylvain Clerc
STMicroelectronics, Crolles Cedex, France
Charlotte Frenkel
TU Delft, Google, Delft, The Netherlands
Ping‐Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan
Dongsuk Jeon
Seoul National University, Seoul, Korea
Monodeep Kar
IBM Thomas J. Watson Research Center, Yorktown Heights, NY
Wen-San Vince Khwa
TSMC, Hsinchu County, Taiwan
Yoonmyung Lee
Sungkyunkwan University, Suwon, Korea
Yimai Peng
Qualcomm, Cary, NC
Joachim Rodrigues
Friedrich-Alexander-University, Erlangen, Germnay
Visvesh Sathe
Georgia Institute of Technology, Atlanta, GA
Mahmut Ersin Sinangil
Nvidia, Santa Clara, CA
Carlos Tokunaga
Intel, Hillsboro, OR
Bo (Angela) Wang
Singapore University, Singapore
Masanao Yamaoka
Hitachi, Tokyo, Japan
Alfred Yeung
AMD, Santa Clara, CA
Image Sensors and Displays (ISD) Subcommittee
Chair: Bruce Rae
STMicroelectronics, Edinburgh, United Kingdom
Jan Bogaerts
Gpixel, Antwerpen, Belgium
Leonardo Gasparini
Fondazione Bruno Kessler, Povo, Italy
Jong-Seok Kim
Hanyang University, Ansan, Korea
Sanshiro Shishido
Panasonic Holdings Corporation, Osaka, Japan
Andreas Suess
Google, Mountain View, CA
Augusto Ximenes
CogniSea, Inc., Seattle, WA
Seunghoon Ko
Kwangwoon University, Seoul, Korea
Atsumi Niwa
Sony Semiconductor Solutions Corporation, Kanagawa, Japan
Preethi Padmanabhan
Pointcloud GmbH, Zürich, Switzerland
Min-Woong Seo
Samsung Electronics Semiconductor R&D Center (SRDC), Hwaseong, Korea
Medical Subcommittee
Chair: Jerald Yoo
Seoul National University, Seoul, Korea
SungWon Chung
Neuralink, Fremont, CA
Wim Dehaene
KULeuven-MICAS, Leuven, Belgium
Azita Emami
California Institute of Technology (Caltech), Pasadena, CA
David He
Eight Sleep, San Francisco, CA
Yaoyao Jia
The University of Texas at Austin, Austin, TX
Hyung-Min Lee
Korea University, Seoul, Korea
Yu-Te Liao
National Yang Ming Chiao Tung University, Hsinchu City, Taiwan
Phillip Nadeau
Analog Devices, Boston, MA
Kiichi Niitsu
Kyoto University, Kyoto, Japan
Mahsa Shoaran
EPFL, Geneva, Switzerland
Xiaolin Yang
imec, Leuven, Belgium
Bo Zhao
Zhejiang University, Hangzhou, China
Memory Subcommittee
Chair: John Wuu
Advanced Micro Devices, Fort Collins, CO
Juang-Ying Chueh
Etron Technology, Taipei, Taiwan
Fabio Disegni
STMicroelectronics, Agrate Brianza, Italy
Chunmeng Dou
Chinese Academy of Sciences (CAS), Beijing, China
Hidehiro (Ricky) Fujiwara
TSMC, Hsinchu, Taiwan
Zheng Guo
Intel, Portland, OR
Thomas Hein
Micron, Munich, Germany
Hua-Ling (Cynthia) Hsu
Sandisk, Milpitas, CA
Vita Pi-Ho Hu
National Taiwan University, Taipei, Taiwan
Bongjin Kim
KAIST, Daejeon, Korea
Dae Hyun Kim
Samsung Electronics, Hwaseong, Korea
Kyunghoon (William) Kim
SK hynix, Seongnam, Korea
Jaydeep Kulkarni
The University of Texas at Austin, Austin, TX
Saekyu Lee
EnCharge AI, Greenwood Village, CO
Gunther Lehmann
Infineon Technologies AG, Neubiberg, Germany
Xueqing Li
Tsinghua University, Beijing, China
Hiroshi Maejima
Kioxia Corporation, Yokohama, Japan
Rawan Naous
Meta Platforms, Pleasanton, CA
Luigi Pilolli
Openchip & Software Technologies, Roma, Italy
Shyh-Shyuan Sheu
ITRI, Hsinchu, Taiwan
Jun Yang
Southeast University, Nanjing, China
Power Management Subcommittee
Chair: Saurav Bandyopadhyay
Texas Instruments, Dallas, TX
Vice-Chair: Patrick Mercier
University of California, San Diego, La Jolla, CA
Sally Amin
Apple, Cupertino, CA
Nicolas Butzen
Intel, Hillsboro, OR
Lin Cheng
University of Science and Technology of China, Anhui, China
Sijun Du
Delft University of Technology, Delft, The Netherlands
Yuan Gao
Southern University of Science and Technology, Shenzhen, China
Jianping Guo
Sun Yat-sen University, Guangzhou, China
Chen-Yen Ho
MediaTek, Hsinchu City, Taiwan
Sung-Wan Hong
Sogang University, Seoul, Korea
Cheng Huang
Iowa State University, Ames, IA
Mo Huang
University of Macau, Taipa, Macao, China
Rinkle Jain
Nvidia, Santa Clara, CA
Xiaocheng Jing
Broadcom, Danville, CA
Shusuke Kawai
Toshiba, Kawasaki, Japan
Xugang Ke
Zhejiang University, Zhejiang, China
Dongsu Kim
Samsung Electronics Systems, Hwaseong, Korea
Hyun-Sik Kim
KAIST, Daejeon, Korea
Hanh-Phuc Le
UCSD, La Jolla, CA
Hans Meyvaert
SoliDC bv, Kessel-Lo, Belgium
Kousuke Miyaji
Shinshu University, Nagano, Japan
Frank Prämaßing
Infineon Technologies Austria AG, Villach, Austria
Anthony Quelen
ST Mircoelectronics, Grenoble, France
Joseph (Joey) Sankman
Analog Devices, Fort Collins, CO
Chris Schaef
Microsoft, San Diego, CA
Tom Van Breussegem
ICsense - TDK, Leuven, Belgium
Serhii Zhak
Renesas, Chandler, AZ
RF Subcommittee
Chair: Brian Ginsburg
Texas Instruments, Dallas, TX
Vice-Chair: Jaehyouk Choi
Seoul National University, Seoul, Korea
Keigo Bunsen
Sony Semiconductor Solutions Corporation, Kanagawa, Japan
Sudipto Chakraborty
Omni Design Technologies, Plano, TX
Dmytro Cherniak
Marvell Technology, Santa Clara, CA
Taiyun Chi
Rice University, Houston, TX
Wooyeol Choi
Seoul National University, Seoul, Korea
Simone Mattia Dartizio
Politecnico di Milano, Milan, Italy
Xiang Gao
Zhejiang University, Zhejiang, China
Ruonan Han
MIT, Cambridge, MA
Yu-Li Hsueh
Mediatek, Hsinchu, Tiawan
Tzu-Yuan Huang
Argus Space AG, Zurich, Switzerland
Vadim Issakov
Braunschweig University of Technology, Braunschweig, Germany
Teruo Jyo
NTT Inc., Kanagawa, Japan
Ping Lu
NVIDIA, Santa Clara, CA
Danilo Manstretta
University of Pavia, Pavia, Italy
Nereo Markulic
imec, Brussels, Belgium
Omeed Momeni
UC Davis, Davis, CA
Mina Shahmohammadi
NXP Semiconductors, Delft, The Netherlands
Teerachot Siriburanon
University College Dublin, Dublin, Ireland
Henrik Sjöland
Lund University & Ericsson Research, Lund, Sweden
Yiwu Tang
Qualcomm Technologies, San Diego, CA
Mikko Varonen
VTT Technical Research Centre of Finland Ltd, Espoo, Finland
Yun Wang
Fudan University, Shanghai, China
Dihang Yang
Broadcom, Irvine, CA
Jun Yin
University of Macau, Taipa, Macau, China
Heein Yoon
Ulsan National Institute of Science and Technology, Ulsan, Korea
Jianjun Zhou
Shanghai Jiao Tong University, Shanghai, China
Security Subcommittee
Chair: Takeshi Sugawara
The University of Electro-Communications, Tokyo, Japan
Utsav Banerjee
Indian Institute of Science, Bengaluru, India
Pasqualina Fragneto
STMicroelectronics, Brianza, Italy
Santosh Ghosh
Nvidia, Hillsboro, OR
Daniel Holcomb
University of Massachusetts Amherst, Amherst, MA
Raghavan Kumar
Intel, Hillsboro, OR
Yong Ki Lee
Samsung Electronics, Suwon, Korea
Itamar Levi
Bar-Ilan University, Ramat Gan, Israel
Leibo Liu
Tsinghua University, Beijing, China
Shreyas Sen
Purdue University, West Lafayette, IN
Technology Directions (TD) Subcommittee
Chair: Alyosha Molnar
Cornell University, Ithaca, NY
Firooz Aflatouni
University of Pennsylvania, Philadelphia, PA
Joseph Bardin
Google & UMass Amherst, Goleta, CA
Anh Tuan Do
A STAR, Singapore, Singapore
Giorgio Ferrari
Politecnico di Milano, Milano, Italy
Kyeongha Kwon
KAIST, Daejeon, Korea
Noriyuki Miura
Osaka University, Osaka, Japan
Pritish Narayanan
IBM Research, San Jose, CA
Jieun Park
Samsung Electronics, Foundry, Suwon, Korea
Chris Rudell
University of Washington, Seattle, WA
Constantine Sederis
Stanford University, Stanford, CA
Minyoung Song
DGIST, Daegu, Korea
Filip Tavernier
KU Leuven, Leuven, Belgium
Albert Wang
Apple, Cupertino, CA
Kaiyuan Yang
Rice University, Houston, TX
Xin (Scott) Yin
Ghent University - imec iGent, Ghent, Belgium
Xuan Zhang
Northeastern University, Boston, MA
Wireless Subcommittee
Chair: Negar Reiskarimian
Massachusetts Institute of Technology (MIT), Cambridge, MA
Alyssa Apsel
Cornell University, Ithaca, NY
Wu-Hsin Chen
Qualcomm, San Diego, CA
Hao Gao
Southeast University, Nanjing, China
Davide Guermandi
imec, Leuven, Belgium
Jose Luis Gonzalez-Jimenez
CEA-Leti, Grenoble, France
Kuo-Ken Huang
Everactive, USA
Konstantinos Manetakis
CSEM, Neuchâtel, Switzerland
Susnata Mondal
Intel, Hillsboro,, OR
Hyun-Chul Park
Samsung (KR), Hwaseong, Korea
Raja Pullela
Maxlinear, USA
Atsuhi Shirane
Institute of Science Tokyo, Tokyo, Japan
Julian Tham
Infineon, San Jose, CA
Alberto Valdes-Garcia
IBM Research, Yorktown Heights, NY
Akshay Visweswaran
Nokia Bell Labs, New Providence,, NJ
Zhiwei Xu
Zhejing University, Zhejing, China
Yun Yin
Fudan University, Shanghai, China
Yuanjin Zheng
School of Electrical and Electronic Engineering Nanyang Technological University, Singapore
Wireline Subcommittee
Chair: Thomas Toifl
Cisco Systems, Thalwil, Switzerland
Tamer Ali
Mediatek, Irvine, CA
Ariel Cohen
Israel Institute of Technology, Haifa, Israel
Zeynep Deniz
IBM, Yorktown Heights, NY
Weixin Gai
Peking University, Beijing, China
Jaeduk Han
Hanyang University, Seoul, Korea
Jay Im
AMD, San Jose, CA
Didem Turker Melek
Cadence Design Systems, San Jose, CA
Ahmed Mostafa
Marvell, Santa Clara, CA
Peter Ossieur
Imec, Univ. Ghent, Ghent, Belgium
Quan Pan
Southern University of Science and Technology (SUSTech), Shenzhen, China
Pen-Jui Peng
National Tsing Hua University, Hsinchu, Taiwan
Ben Rhew
Samsung, Hwaseong, Korea