Technical Committees
Technical Editors
Jason H. Anderson
University of Toronto, Toronto, Canada
Leonid Belostotski
The University of Calgary, Calgary, Canada
Dustin Dunwell
Alphawave IP, Toronto, Canada
Vincent Gaudet
University of Waterloo,Waterloo, Canada
Glenn Gulak
University of Toronto, Toronto, Canada
James W. Haslett
The University of Calgary, Calgary, Canada
Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada
Samantha Murray
StarIC, Toronto, Canada
Multi-Media Coordinator and Digest Editor
David Halupka
StarIC, Toronto, Canada
Program Chair
Keith Bowman
Qualcomm, Raleigh, NC
Program Vice-Chair
Marian Verhelst
KU Leuven & imec, Belgium
ITPC AM (Americas) Regional Chair
Danielle Grifith
Texas Instruments, Dallas, TX
ITPC AM (Americas) Regional Vice-Chair
Jacques "Chris" Rudell
University of Washington, Seattle, WA
ITPC APAC (Asia Pacific) Regional Chair
Wei-Zen Chen
National Yang Ming Chiao Tung University, Hsinchu, Taiwan
ITPC APAC (Asia Pacific) Regional Vice Chair
Kousuke Miyaji
Shinshu University, Nagano, Japan
ITPC EWAA (Europe, West Asia, Africa) Regional Chair
Jens Anders
University of Stuttgart, Stuttgart, Germany
ITPC EWAA (Europe, West Asia, Africa) Regional Vice Chair
Qinwen Fan
Delft University of Technology, Delft, The Netherlands
Analog Subcommittee
Chair: Viola Schaffer
Texas Instruments, Freising, Germany
Ippei Akita
AIST, Tsukuba, Japan
Jens Anders
University of Stuttgart, Stuttgart, Germany
Harijot Singh Bindra
University of Twente, Enschede, The Netherlands
Edoardo Bonizzoni
University of Pavia, Pavia, Italy
Mei-Chen Chuang
TSMC, Hsinchu, Taiwan
Chinwuba Ezekwe
Robert Bosch, Sunnyvale, CA
Qinwen Fan
Delft University of Technology, Delft, The Netherlands
Danielle Grifith
Texas Instruments, Dallas, TX
Drew Hall
University of California, San Diego, La Jolla, CA
Chuan-Hung Hsiao
MediaTek, Hsinchu City, Taiwan
Minkyu Je
KAIST, Yuseong-gu, Korea
Ka-Meng Lei
University of Macau, Macau
Tim Piessens
KU-Leuven ESAT-MICAS, Leuven, Belgium
Caspar van Vroonhoven
Analog Devices, Ismaning, Germany
Yihan Zhang
Hong Kong University of Science and Technology (HKUST), Hong Kong
Data Converters Subcommittee
Chair: Jan Westra
Broadcom, Bunnik, The Netherlands
Lucien J. Breems
NXP Semiconductors, Eindhoven, The Netherlands
Chi-Hang (Ivor) Chan
University of Macau, Macau, China,
Vanessa Chen
Carnegie Mellon University, Pittsburgh, PA, TX
Pieter Harpe
Eindhoven University of Technology, Eindhoven, The Netherlands
Wan Kim
Samsung Electronics, Hwasung-si, Korea
Chin-Yu Lin
Mediatek, Hsinchu City, Taiwan
Nima Maghari
University of Florida, Gainesville, FL
Ewout Martens
imec, Leuven, Belgium
Shahrzad Naraghi
Anaflash, Sunnyvale, CA
Shanthi Pavan
IIT Madras Dept of Electrical Eng., Chennai, India
Seung-Tak Ryu
KAIST, Daejeon, Korea
Hajime Shibata
Analog Devices, Toronto, Canada
Shiyu Su
University of Waterloo, Waterloo, Canada
Xiyuan Tang
Peking University, Beijing, China
Amy Whitcombe
Intel, Santa Clara, CA
Il-Min Yi
Gwangju Institute of Science and Technology, Gwangju, Korea
Digital Architectures & Systems (DAS) Subcommittee
Chair: Rahul Rao
IBM India, Bangalore, India
Mark A. Anders
Intel, Hillsboro, OR
Francesco Conti
University of Bologna, Bologna, Italy
Giuseppe Desoli
STMicroelectronics S.p.A. Italy, Cornaredo, Italy
Jie Gu
Northwestern University, Evanston, IL
Sumanth Gururajarao
MediaTek, Austin, TX
Ji-Hoon Kim
Hanyang University, Seoul, Korea
Sugako Otani
Renesas Electronics, Tokyo, Japan
Jun-Seok Park
S.LSI, Samsung Electronics, Gyeonggi-do, Korea
Nathaniel Pinckney
Nvidia, Austin, TX
Priyanka Raina
Stanford University, Stanford, CA
Soojung Ryu
Seoul National University, Seoul, Korea
Pei-Yun Tsai
National Taiwan University, Taipei, Taiwan
Paul Whatmough
Qualcomm, Boston, MA
Srividhya Venkataraman
AMD, Santa Clara, CA
Zhengya Zhang
University of Michigan, Ann Arbor, MI
Jun Zhou
University of Electronic Science and Technology of China, Chengdu, China
Digital Circuits (DCT) Subcommittee
Chair: Huichu Liu
Meta Platforms, Sunnyvale, CA
Sylvain Clerc
STMicroelectronics, Crolles Cedex, France
Eric Jia-Wei Fang
Mediatek, Hsinchu City, Taiwan
Kazuki Fukuoka
Renesas Electronics, Tokyo, Japan
Ping‐Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan
Dongsuk Jeon
Seoul National University, Seoul, Korea
Jaydeep Kulkarni
The University of Texas at Austin, Austin, TX
Joachim Rodrigues
Lund University, Lund, Sweden
Visvesh Sathe
Georgia Institute of Technology, Atlanta, GA
Jae-sun Seo
Cornell Tech, New York, NY
Mahmut Ersin Sinangil
Nvidia, Santa Clara, CA
Carlos Tokunaga
Intel, Hillsboro, OR
Kaushik Vaidyanathan
OpenAI, San Francisco, CA
Bo (Angela) Wang
Singapore University, Singapore
Masanao Yamaoka
Hitachi, Tokyo, Japan
Alfred Yeung
AMD, Santa Clara, CA
Image Sensors and Displays (ISD) Subcommittee
Chair: Bruce Rae
STMicroelectronics, Edinburgh, United Kingdom
Jan Bogaerts
Gpixel, Antwerpen, Belgium
Leonardo Gasparini
Fondazione Bruno Kessler, Povo, Italy
Mutsumi Hamaguchi
Sharp Corporation, Tenri City, Japan
Sanshiro Shishido
Panasonic Holdings Corporation, Osaka, Japan
Andreas Suess
Google, Mountain View, CA
Augusto Ximenes
CogniSea, Inc., Seattle, WA
Seunghoon Ko
Kwangwoon University, Seoul, Korea
Masaki Sakakibara
Sony Semiconductor Solutions Corporation, Kanagawa, Japan
Min-Woong Seo
Samsung Electronics Semiconductor R&D Center (SRDC), Hwaseong-si, Korea
Medical Subcommittee
Chair: Rikky Muller
University of California Berkeley, Berkeley, CA
SungWon Chung
Neuralink, Fremont, CA
Azita Emami
California Institute of Technology (Caltech), Pasadena, CA
Venugopal Gopinathan
Analog Devices, Wilmington, MA
Taekwang Jang
ETH Zurich, Zurich, Switzerland
Hyung-Min Lee
Korea University, Seoul, Korea
Yu-Te Liao
National Yang Ming Chiao Tung University, Hsinchu City, Taiwan
Carolina Mora-Lopez
Imec, Leuven, Belgium
Michiel Pertijs
Delft University of Technology, Delft, The Netherlands
Mahsa Shoaran
EPFL, Geneva, Switzerland
Bo Zhao
Zhejiang University, Hangzhou, China
Memory Subcommittee
Chair: John Wuu
Advanced Micro Devices, Fort Collins, CO
Juang-Ying Chueh
Etron Technology, Taipei, Taiwan
Chunmeng Dou
Chinese Academy of Sciences (CAS), Beijing, China
Zheng Guo
Intel, Portland, OR
Thomas Hein
Micron, Munich, Germany
Hua-Ling (Cynthia) Hsu
Sandisk, Milpitas, CA
Vita Pi-Ho Hu
National Taiwan University, Taipei, Taiwan
Takashi Ito
Renesas, Tokyo, Japan
Monodeep Kar
IBM, Yorktown Heights, NY
Bongjin Kim
KAIST, Daejeon, Korea
Dongkyun Kim
SK hynix, Icheon-si, Korea
Hye-Ran Kim
Samsung Electronics, Anyang, Korea
Saekyu Lee
EnCharge AI, Greenwood Village, CO
Gunther Lehmann
Infineon Technologies AG, Neubiberg, Germany
Xueqing Li
Tsinghua University, Beijing, China
Luigi Pilolli
Openchip & Software Technologies, Roma, Italy
Shyh-Shyuan Sheu
ITRI, Hsinchu, Taiwan
Hidehiro Shiga
KIOXIA, Yokohama, Japan
Eric Wang
TSMC, Hsinchu, Taiwan
Jun Yang
Southeast University, Nanjing, China
Power Management Subcommittee
Chair: Bernhard Wicht
University of Hannover, Hannover, Germany
Vice-Chair: Saurav Bandyopadhyay
Texas Instruments, Dallas, TX
Sally Amin
Apple, Cupertino, CA
Patrik Arno
ST Microelectronics, Sassenage, France
Nicolas Butzen
Intel, Hillsboro, OR
Lin Cheng
University of Science and Technology of China, Anhui, China
Sijun Du
Delft University of Technology, Delft, The Netherlands
Yuan Gao
Southern University of Science and Technology, Shenzhen, China
Jianping Guo
Sun Yat-sen University, Guangzhou, China
Chen-Yen Ho
MediaTek, Hsinchu City, Taiwan
Sung-Wan Hong
Sogang University, Seoul, Korea
Cheng Huang
Iowa State University, Ames, IA
Mo Huang
University of Macau, Taipa, Macao, China
Rinkle Jain
Nvidia, Santa Clara, CA
Xiaocheng Jing
Qualcomm, Santa Clara, CA
Shusuke Kawai
Toshiba, Kawasaki, Japan
Xugang Ke
Zhejiang University, Zhejiang, China
Dongsu Kim
Samsung Electronics Systems, Hwaseong-si, Korea
Hyun-Sik Kim
KAIST, Daejeon, Korea
Hanh-Phuc Le
UCSD, La Jolla, CA
Xun Liu
The Chinese University of Hong Kong, Shenzhen, China
Kousuke Miyaji
Shinshu University, Nagano, Japan
Filippo Neri
Renesas Design Zürich AG, Zürich, Switzerland
Frank Pramassing
Infineon Technologies Austria AG, Villach, Austria
Joseph (Joey) Sankman
Analog Devices, Fort Collins, CO
Xin Zhang
IBM T. J. Watson Research Center, Yorktown Heights, NY
RF Subcommittee
Chair: Brian Ginsburg
Texas Instruments, Dallas, TX
Vice-Chair: Masoud Babaie
Delft University of Technology, Delft, The Netherlands
Sudipto Chakraborty
IBM T. J. Watson Research Center, Yorktown Heights, NY
Dmytro Cherniak
Infineon Technologies, Villach, Austria
Taiyun Chi
Rice University, Houston, TX
Wooyeol Choi
Seoul National University, Seoul, Korea
Jeremy Dunworth
Qualcomm Technologies Inc., San Diego, CA
Xiang Gao
Zhejiang University, Zhejiang, China
Hiroshi Hamada
NTT, Kanagawa, Japan
Ruonan Han
MIT, Cambridge, MA
Yu-Li Hsueh
Mediatek, Hsinchu, Tiawan
Ping Lu
Microsoft, Redmond, WA
Danilo Manstretta
University of Pavia, Pavia, Italy
Omeed Momeni
UC Davis, Davis, CA
Jiayoon Ru
Peking University, Beijing, China
Mina Shahmohammadi
NXP Semiconductors, Delft, The Netherlands
Atsuhi Shirane
Institute of Science, Tokyo, Japan
Teerachot Siriburanon
University College Dublin, Dublin, Ireland
Henrik Sjöland
Lund University & Ericsson Research, Lund, Sweden
Mikko Varonen
VTT Technical Research Centre of Finland Ltd, Espoo, Finland
Yun Wang
Fudan University, Shanghai, China
Dihang Yang
Broadcom, Irvine, CA
Jun Yin
University of Macau, Taipa, Macau, China
Heein Yoon
Ulsan National Institute of Science and Technology, Ulsan, Korea
Security Subcommittee
Chair: Takeshi Sugawara
The University of Electro-Communications, Tokyo, Japan
Utsav Banerjee
Indian Institute of Science, Bengaluru, India
Pasqualina Fragneto
STMicroelectronics, Brianza, Italy
Santosh Ghosh
Nvidia, Hillsboro, OR
Daniel Holcomb
University of Massachusetts Amherst, Amherst, MA
Chiraag Juvekar
Apple, San Carlos, CA
Yong Ki Lee
Samsung Electronics, Suwon, Korea
Leibo Liu
Tsinghua University, Beijing, China
Thomas Poeppelmann
Infineon Technologies, Neubiberg, Germany
Shreyas Sen
Purdue University, West Lafayette, IN
Technology Directions (TD) Subcommittee
Chair: Alyosha Molnar
Cornell University, Ithaca, NY
Firooz Aflatouni
University of Pennsylvania, Philadelphia, PA
Uygar Avci
Intel, Hillsboro, OR
Joseph Bardin
Google & UMass Amherst, Goleta, CA
Giorgio Ferrari
Politecnico di Milano, Milano, Italy
Koji Inoue
Kyushu University, Fukuoka, Japan
Kyeongha Kwon
KAIST, Daejeon, Korea
Noriyuki Miura
Osaka University, Osaka, Japan
Daniel H. Morris
OpenAI, San Francisco, CA
Jacques "Chris" Rudell
University of Washington, Seattle, WA
Fabio Sebastiano
Delft University of Technology, Delft, The Netherlands
Kaushik Sengupta
Princeton University, Princeton, NJ
Minyoung Song
DGIST, Daegu, Korea
Guy Torfs
Ghent University, Ghent, Belgium
Albert Wang
Apple, Cupertino, CA
Kaiyuan Yang
Rice University, Houston, TX
Wireless Subcommittee
Chair: Chih-Ming Hung
MediaTek, Taipei, Taiwan
Alyssa Apsel
Cornell University, Ithaca, NY
Wu-Hsin Chen
Qualcomm, San Diego, CA
Hao Gao
Southeast University, Nanjing, China
Jose Luis Gonzalez-Jimenez
CEA-Leti, Grenoble, France
Giuseppe Gramegna
imec, Leuven, Belgium
Kuo-Ken Huang
Everactive, USA
Konstantinos Manetakis
CSEM, Neuchâtel, Switzerland
Hyun-Chul Park
Samsung (KR), Hwaseong, Korea
Raja Pullela
Maxlinear, USA
Negar Reiskarimia
Massachusetts Institute of Technology (MIT), Cambridge, MA
Shahriar Shahramian
Nokia – Bell Labs, New Providence, NJ
Julian Tham
Infineon, San Jose, CA
Alberto Valdes-Garcia
IBM Research, Yorktown Heights, NY
Zhiwei Xu
Zhejing University, Zhejing, China
Yun Yin
Fudan University, Shanghai, China
Yuanjin Zheng
School of Electrical and Electronic Engineering Nanyang Technological University, Singapore
Alireza Zolfaghari
Broadcom, Irvine, CA
Wireline Subcommittee
Chair: Thomas Toifl
Cisco Systems, Thalwil, Switzerland
Tamer Ali
Mediatek, Irvine, CA
Wei-Zen Chen
National Yang Ming Chiao Tung University, Hsinchu, Taiwan
Zeynep Deniz
IBM, Yorktown Heights, NY
Masum Hossain
Carleton University Department of Electronics, Ottawa, Canada
Kenny Hsieh
TSMC, Hsinchu, Taiwan
Jay Im
AMD, San Jose, CA
Didem Turker Melek
Cadence Design Systems, San Jose, CA
Ahmed Mostafa
Marvell, Santa Clara, CA
Peter Ossieur
Imec, Univ. Ghent, Ghent, Belgium
Quan Pan
Southern University of Science and Technology (SUSTech), Shenzhen, China
Ben Rhew
Samsung, Hwaseong, Korea