ISSCC Call for Papers Overview — ISSCC - International Solid-State Circuits Conference

Overview & updates

The foremost global forum for the presentation of advances in solid-state circuits and systems-on-a-chip. ISSCC 2027 is in its 74th year.

⬇ Download the ISSCC 2027 Call for Papers (PDF)

Important Submission Updates & Information

1. NEW A figure density checking tool, the ISSCC Figure Density Check, helps you confirm your figures are readable. Authors must confirm at submission that they have used the tool..

2. NEW At submission, authors declare and explain any potential conflicts of interest (COI) with iTPC members of the selected subcommittees. This step is completed in the submission form; detailed guidelines are on the Submissions Website.

3. NEW ISSCC 2027 introduces Open Science Badges (Open Design / Open Data) to recognize sharing the artifacts behind your paper. Voluntary; badges are assigned after acceptance.

4. Make sure that ALL related work is sufficiently referenced, including your own. Undisclosed pre-publications may lead to withdrawal of an accepted paper.

5. Submissions with a clear blind-review violation are penalized during Paper Selection, affecting acceptance, awards, and the JSSC Special Issue invitation. Notifying Program Committee members outside your organization of your submission results in immediate rejection.