Contents: List of Evening Panel Discussions
E1 Does Fabless Mean Futureless for Imaging?
Organizer: Albert Theuwissen, Philips Semiconductors, Eindhoven, The Netherlands
Moderator: Daniel McGrath, Atmel, San Jose, CA
Panel:
E2 10 Years of RF-CMOS - But How Many Products Today?
Organizer / Moderator: Rudolf Koch, Infineon Technologies, Munich, Germany
Panel:
E3 Has Scaling Created a Microprocessor Monster?
Organizer: Kerry Bernstein, IBM Microelectronics, Essex Jct., VT
Moderator: David Greenhill, Sun Microsystems, Pala Alto, CA
Panel:
Co-Organizers: J. Miyuamoto, Toshiba, Yokohama, Japan / T. Kawahara, Hitachi, Tokyo, Japan
Moderator: Gregory Atwood, Intel Corp., Santa Clara, CA
Panel:
E5 Embedded DRAM: Curiosity or Workhorse?Carlos Paz de Araujo, Symetrix, Colorado Springs, CO Boaz Eitan, Saifun Semiconductors, Netanya, Israel Saied Tehrani, Motorola, Tempe, AZ Koji Sakui, Toshiba Corp., Yokohama, Japan Albert Fazio, Intel Corp., Santa Clara, CA David Foote, IBM, San Jose, CA Tatsuro Takahashi, Kyoto University, Kyoto, Japan
Organizer: Jeffrey Dreibelbis, IBM, Essez Jct., VT
Moderator: Don Stark, Rambus, Mountain View, CA
Panel:
E6 Broadband Access - Who Will Win the Race: Copper, Fiber or Wireless?Tohru Furuyama, Toshiba, Kawasaki, Japan Dean Klein, Micron Technologies Inc., Boise, ID Subramanian Iyre, IBM Microelect. Div., Hopewell Junction, NY Wingyu Leung, Mosys Inc., Sunnyvale, CA Sadish Soman, Axiowave Networks, Marlborough, MA Clair Webb, Intel Corp., Hillsboro, OR
Organizer: Tyson Tuggle, Silicon Labs, Austin, TX
Moderator: Gitty Nasserbakht, Proxim, Sunnyvale, CA
Panel:
E7 100cubed: Science or Fiction? Is It Possible to Design a 100mm2 System-on-Chip with 100M Transistors in 100 Days?Henry Samueli, Broadcom Corp., Irvine, CA John Cioffi, Stanford Univ., Stanford, CA Mamoru Kitamura, NTT, Kanagawa, Japan Paulraj, Gigabit Wireless, San Jose, CA Leon Cloetens, Alcatel Microelectronics, Zaventem, Belgium Gerry Pepenella, Silicon Laboratories, Austin, TX Derek Schaefer, Freespace Communications, Palo Alto, CA
Organizer: Ivo Bolsens, IMEC, Leuven, Belgium
Moderator: Jan Rabaey, UC Berkeley, CA
Panel:
E8 Are Startups Killing Innovation?Hugo De Man, IMEC, Leuven, Belgium Andrea Cuomo, ST Microelectronics, Geneva, Switzerland Harry Veendrick, Philips Semiconductor, Eindhoven, The Netherlands Aart De Geus, Synopsys, Mountain View, CA Alberto Sangiovanni-Vincentelli, Cadence, Milpitas, CA Mehdi Hatamanian, Broadcom, Irvine, CA
Organizer: Venugopal Gopinathan, Broadcom, Irvine, CA
Moderator: David Johns, Univ. Toronto, Toronto, Ont., Canada
Panel:
For more information, consult the Advance ProgramNav Sooch, Silicon Labs, Austin, TX Bob Hewes, Texas Instruments, Dallas, TX Bryan Ackland, Bell Labs, Holmdel, NJ Masao Hotta, Hitachi, Gunma, Japan Klaas Bult, Broadcom, Utrect, The Netherlands Ron Rohrer, Carnegie Mellon Univ., Pittsburgh, PA
ME1 When Can I Buy a Dick Tracy Watch for Christmas?
Organizer: Phillip Wong, IBM T. J. Watson Research Ctr, Yorktown Heights, NY
Moderator: Woodward Yang, Harvard University, Cambridge, MA
Panel:
ME2 Where Will Processor Performance Come From in the Next Ten Years?Steve Mann, University of Toronto, Toronto, Ontario, Canada Wai Lee, Texas Instruments, Dallas, TX Eric Vittoz, CSEM Centre Suisse d'Electronique et de Microtechnique SA, Neuchâtel, Switzerland Rein de Graaf, Philips Research, Eindhoven, The Netherlands Sven Mattison, Ericsson Mobile Communications AB, Lund, Sweden Yuji Kitamura, Sanyo Semiconductors, Rochelle Park, NJ
Co-organizer / Moderator: Krste Asanovic, Mass. Inst. of Tech, Cambridge, MA
Co-organizer: William Bowhill, Compaq Computer Corp., Shrewsbury, MA
Panel:
ME3 Engineering Resources: Train, Buy, or Steal?William Dally, Stanford University, Stanford, CA Joel Emer, Compaq Computer Corp., Shrewsbury, MA Frank Fox, Rambus Inc., Mountain View, CA Wen-Mei Hwu, Univ. of Illinois at Urbana-Champaign, Urbana, IL Hiroshi Iwai, Tokyo Institute of Technology, Midori-ku, Yokohama, Japan Fred Pollack, Intel Corp., Santa Clara, CA Fred Weber, AMD, Sunnyvale, CA
Organizer: Todd Brooks, Broadcom Corp., Irvine, CA
Moderator: David Robertson, Analog Devices, Wilmington, MA
Panel:
ME4 Memory Designer: Survivor or Dinosaur?Theo Claasen, Philips Semiconductors, Eindhoven, The Netherlands Nicky Lu, Etron Technology Inc., Hsinchu, Taiwan, ROC Mary Jane Raymond, Lucent Technologies, Murray Hill, NJ Nav Sooch, Silicon Laboratories, Inc., Austin, TX T. R. Viswanathan, Texas Instruments, Dallas, TX Bob Wiederhold, Cadence Design Systems, Inc., San Jose, CA
Organizer / Moderator: Jagdish Pathak, Sub Micron Circuits, Inc., San Jose, CA
Panel:
TE5 Can System LSI be a Technology Driver for the Coming Ten Years?Jim Kupec, UMC Group, Sunnyvale, CA Prakash Bhalerao, Amber Networks, Cupertino, CA Michael G. Kliment, Virtual Silicon Technology, Inc., Sunnyvale, CA Robert Proebsting, Integrated Device Technology, Santa Clara, CA Richard Foss, MOSAID Technologies, Inc., Kanata, Ontario, Canada Adam Kablanian, Virage Logic Corporation, Fremont, CA
Co-organizers: Hirotaka Tamura, Fujitsu Labs, Ltd., Nakahara, Kawasaki, Japan / Shigeo Kuninobu, Matsushita Electric, Nagaoka, Kyoto, Japan
Moderator: Takayasu Sakurai, University of Tokyo, Minato, Tokyo, Japan
Panel:
TE6 RF and High-Speed Interfaces: 50 Ohm or Freedom? Low Voltage Differential or Custom?Emmanuel Crabbe, IBM Semiconductor R & D Ctr, Hopewell Junction, NY Herman Casier, Alcatel, Brussels, Belgium Minoru Yamamoto, Fujitsu Ltd., Nakahara, Kawasaki, Japan Chuck Dennison, Micron Technology, Boise, ID Tetsuya Iizuka, THine Electronics Inc., Tokyo, Japan Tadahiko Nakamura, Sony Corp., Tokyo, Japan
Co-organizers / Co-moderators: Jan Sevenhans, Alcatel, Antwerp, Belgium/Christer Svensson, Link öping University, Linköping, Sweden
Panel:
TE7 Home Networking: Wired or Wireless?Helmut Preisach, Alcatel SEL AG, Stuttgart, Germany Shekhar Borkar, Intel Corporation, Hillsboro, OR Michiel Steyaert, K.U., Leuven, Heverlee, Belgium Yoshihiko Ashida, Murata Manufacturing Co. Ltd., Nagasaka, Japan Herman Boss, Rhode & Schwartz GmbH, Munich, Germany Thaddeus Gabara, Bell Labs, Lucent Technologies, Murray Hill, NJ
Co-organizers: Lars Thon, T-Span Systems, Corp., Palo Alto, CA / Wanda Gass, Texas Instruments, Dallas, TX
Moderator: Victor Bahl , Microsoft Research, Redmond, WA
Panel:
TE8 Nostradamus II: Technology's Impact on the Next MillenniumRan Yan, Bell Labs, Lucent Technologies, Holmdel, NJ Edward H. Frank, Epigram Inc., Sunnyvale, CA Alberto Mantovani, Conexant Systems Inc., Newport Beach, CA Brent Myers, Intersil, Palm Bay, FL Sven Mattisson, Ericsson Mobile Communications AB, Lund, Sweden Neil Weste, Radiata Communications Pty Ltd., Epping, Australia Modest Oprysko, IBM Research Division, Yorktown Heights, NY
Co-organizers / Co-moderators: Trudy Stetzler, Texas Instruments, Stafford, TX / Mary Jo Nettles, AMCC, San Diego, CA
Panel:
W. H. Korving, Philips Semiconductors B.V., Eindhoven, The Netherlands Earl McCune, Tropian Inc., Cupertino, CA Gene A. Frantz, Texas Instruments, Stafford, TX Jim Ebentier, AMCC, San Diego, CA Shumpei Kawasaki, Hitachi, Los Altos Hills, CA Eric Shutz, Alcatel Microelectronics, Zaventem, Belgium
ME1 "They Don't Make Engineers Like They Used To. ...?"
Moderator / Organizer: Thomas Lee, Stanford Univ., Stanford, CA
Co-organizer: Mary Jo Nettles, AMCC, San Diego, CA
Panel:
ME2 The Single-Chip Digital Mobile Radio: Does it Really Make Sense?Hugo De Man, Katholieke Universiteit, Leuven, Belgium Nicky Lu, ETRON Technology, Hsinchu, Taiwan, R.O.C. Bob Pease, National Semiconductor, Santa Clara, CA Behzad Razavi, UCLA, Los Angeles, CA Charles Sodini, MIT, Cambridge, MA Eric Swanson, Crystal Semiconductor, Austin, TX
Organizer / Moderator: Ernesto Perea, STMicroelectronics, Croilles, France
Co-Organizer: Rudy Van de Plassche, Eindhoven Univ. of Technology, Eindhoven, The Netherlands
Panel:
ME3 SRAMs in the Early 21st CenturyJoseph Fenk, Siemens Semiconductor Group, Munich, Germany Sven Mattison, Ericsson Mobile Communications, Lund, Sweden Jan Sevenhans, Alcatel, Antwerpen, Belgium. Michiel Steyaert, Katholieke Universiteit, Leuven, Belgium Ton Wagemans, Philips Res. Labs, Eindhoven,The Netherlands Werner Gruber, Nokia, Tew Technology Sourcing, Salo, Finland Ken Hanson, Motorola, Austin, TX
Moderator: Don Draper, Advanced Micro Devices, Sunnyvale, CA
Organizer: Ban-Pak Wong, Sun Microsystems, Palo Alto, CA
Panel:
ME4 The Best and Worst in the Evolution of Digital IC DesignTony Alvares, Cypress Semiconductor, San Jose, CA Geordie Braceras, IBM, Essex Junction, VT J. Thomas Pawlowski, Micron, Boise, ID David Chapman, Motorola, Austin, TX Hyun-Geun Byun, Samsung, Yongin City, Kyungki, Korea Steven Eliscu, IDT, Santa Clara, CA
Moderator / Organizer: John Maneatis, JGM Enterprises, Redwood City, CA
Co-organizer: Kevin Donnelly, Rambus, Mountain View, CA
Panel:
TE5 Managing Innovation - An Oxymoron?Bill Bidermann, Chromatic, Sunnyvale, CA Mark Horowitz, Stanford Univ., Stanford, CA Mark Johnson, Rhombus, Menlo Park, CA Toshiaki Masuhara, Hitachi, Tokyo, Japan Peter Stoll, Intel, Albuquerque, NM Christer Svensson, Linköping Univ, Linköping, Sweden
Moderator: Paul Brokaw, Analog Devices, Wilmington, MA
Co-Organizers: Paul Brokaw, Analog Devices, Wilmington, MA / Klaas Bult, Broadcom, Irvine, CA /Christian Enz, Rockwell Semiconductor Systems, Newport Beach, CA
Panel:
TE6 When Will MEMS Appear in Every Communication System?J. Gifford, Maxim, Sunnyvale, CA A. Matsuzawa, Matsushita, Osaka, Japan H. Nicholas, Broadcom, Irvine, CA B. Pease, National Semiconductor, Santa Clara, CA D. Robertson, Analog Devices, Wimington, MA Y. Tsividis, Columbia Univ., New York, NY E. Vittoz, CSEM, Neuchatel, Switzerland
Moderator: Kaigham (Ken) Gabriel, Carnegie Mellon Univ., Pittsburgh, PA
Organizer: William J. Kaiser, UCLA, Los Angeles, CA
Panel:
TE7 Hardware is King, Software is Queen: Has Hardware Become a Second-Class Citizen to Software?Clark Nguyen, Univ. of Michigan, Ann Arbor, Michigan Jason Yao, Rockwell Science Center, Thousand Oaks, CA Leo Pellon, Lockheed Martin, Morristown, NJ Elliott Brown, UCLA, Los Angeles, CA Bernhard Boser, Univ. of California, Berkeley, CA Hector J. De Los Santos, Hughes Space and Communications, Los Angeles, CA
Moderator: Richard Newton, Unv. of California, Berkeley, CA
Co-Organizers: Ingrid Verbauwhede, UCLA, Los Angeles, CA / Teresa Meng, Stanford Univ., Palo Alto, CA
Panel:
TE8 Who Controls the Value of Semiconductor Devices, IP Designers or Semiconductor Engineers?Patrick W. Bosshart, Texas Instruments, Dallas, TX Robert Brodersen, Univ. of California, Berkeley, CA Dan Dobberpuhl, SiByte, Menlo Park, CA K.C. Murphy, Cadence, San Jose, CA Takayasu Sakurai, Univ. of Tokyo, Tokyo, Japan Yomtov Sidi, National Semiconductor, Herzlia, Israel
Moderator / Co-organizer: G. Saucier, INPG, Gabriele, France
Organizer: Kunihiro Asada, Univ. of Tokyo, Tokyo, Japan
Panel:
Tadahiro Ohmi, Tohoku Univ., Sendai, Japan Grant Martin, Cadence, San Jose, CA Alistair Greenhill, ARM Ltd., Cambridge, UK Eric Schutz, Alcatel, Zaventem, Belgium Joel Karp, Rambus, Mountain View, CA Rich Donaldson, Texas Instruments, Dallas, TX Shojiro Mori, Toshiba Corp., Tokyo, Japan
TE1 Three Decades of DRAM Development, Debate, and Distinction
Moderator: R. C. Foss, Mosaid Technologies, Kanata, Ontario, Canada
Organizer: Bill Martino, Motorola, Austin, Texas
Panel:
TE2 How much Analog is going to survive on large digital chips?Kurt Hoffmann, Bundeswehr University, Munich, Germany Howard Kalter, IBM, Essex Junction, Vermont Joel Karp, Consultant, Menlo Park, California Mitsu Koyanagi, Tohoku University, Sendai, Japan Jerry Moench, AMD, Austin, Texas Bob Proebsting, IDT, Santa Clara, California
Moderator / Organizer: Klaas Bult, Broadcom Corp., Irvine, CA
Co-Organizer: Ken Martin, University of Toronto, Canada
Panel:
TE3 Sub 1V CMOS: SOI or BULK?Chris Mangelsdorf, Analog Devices, Tokyo, Japan Tsutomu Wakimoto, NTT, Kanagawa, Japan Asad Abidi, UCLA, Los Angeles, CA Marcel Pelgrom, Philips Research Labs., Eindhoven, The Netherlands Timothy J. Schmerbeck, IBM, Rochester, MN Frank Carr, Rockwell International Corp., Newport Beach, CA
Co-Moderators / Co-Organizer: Jan Sevenhans, Alcatel, Antwerp, Belgium / Christer Svensson, Link÷ping University, Sweden
Panel:
TE4 Will Power Limit Microprocessor Performance?Kristin Demeyer, KUL, IMEC, Leuven, Belgium Jerry Yue, Honeywell, Plymouth, MN Seiichiro Kawamura, Fujitsu, Kawasaki, Japan Masakazu Kakumu, Toshiba, Kawasaki, Japan Ted Houston, Texas Instruments Inc., Dallas, TX Jean Pierre Colinge, UCL, DICE, Louvain la Neuve, Belgium Koichiro Mashiko, Mitsubishi, Itami, Japan Michael Alles, IBIS, Danvers, MA Andre-Jacques Auberton-Herve, SOITEC, Grenoble, France
Moderator / Co-Organizer: William Bowhill, Digital Equipment , Hudson, MA
Co-Organizer: David Greenhill, Sun Microsystems, Mountain View, CA
Panel:
FE5 Will CMOS Image Sensors Survive Scaling?Randy Allmon, Digital Equipment Corp., Hudson, MA David Bearden, Motorola Inc., Austin, TX Kerry Bernstein, IBM Microelectronics Division, Essex Junction, VT Mark Bohr, Intel Corp., Hillsboro, OR Shashank Goel, Simplex Solutions Inc., Sunnyvale, CA Ray Heald, Sun Microsystems Inc., Mountain View, CA Masakazu Yamashina, NEC Corp., Kanagawa, Japan
Moderator: Albert Theuwissen, Philips Research Labs., Eindhoven, The Netherlands
Organizer: Abbas El Gamal, Stanford University, Stanford, CA
Panel:
FE6 How Will Media Signal Processors Dominate the Next Decade?H-S. Wong, IBM, TJ Watson, Yorktown Heights, NY Yoshiyuki Matsunaga, Toshiba, Kawasaki, Japan Daniel McGrath, Polaroid Corp., Cambridge, MA Kit M. Cham, Helwett-Packard Labs., Palo Alto, CA Jack Uppal, Intel Corp., Santa Clara, CA Nobukazu Teranishi, NEC Corp., Kanagawa, Japan J. E. D. Hurwitz, VLSI Vision Ltd., Edinburgh, Scotland
Moderator: William Bidermann, Chromatic Research, Sunnyvale, CA
Organizer: Steve Purcell, Chromatic Research, Sunnyvale, CA
Panel:
FE7 LSI Solutions and Enabling Technologies for Mobile Multimedia Devices at the Year 2000K. Guttag, Texas Instruments, Plano, TX D. Patterson, University of California at Berkeley, CA B. Prasad, Intel Corp., Santa Clara, CA S. Purcell, Chromatic Research, Sunnyvale, CA T. Sakurai, University of Tokyo, Tokyo, Japan F. Sijstermans, Philips Research Labs., Eindhoven, The Netherlands
Moderator: T. Meng, Stanford University, Stanford, CA
Co-organizers: T. Baba, Matsushita Semiconductor of America, Palo Alto, CA / T. Sumi, MatsushitaElectronics Corp., Osaka, Japan / K. Sasaki, Hitachi Central Research Labs., Tokyo, Japan
Panel:
FE8 Global Communications: the good, the bad, and the uglyR. Brodersen, UC Berkeley, CA C. Chien, Rockwell Science Center, Thousand Oaks, CA S. Kawasaki, Hitachi Microsystems Inc., San Jose, CA T. Lee, Stanford University, CA H. Meyr, Aachen University, Templergraben, Germany M. Motomura, NEC, Kanagawa, Japan W. Sansen, Katholieke Universiteit Leuven, Belgium
Moderator / Organizer: Rick Walker, Hewlett-Packard, Palo Alto, CA
Panel:
Ganesh R. Basawapatna, Encore Television, Englewood, CO Rev. Heng Sure, Berkeley Buddhist Monastery, Berkeley, CA Richard Bateman, Teacher and Educator, San Francisco, CA Tom Mahon, Silicon Valley Publicist, San Francisco, CA Martin J. Verhoeven, Institute for World Religions, Berkeley, CA Francois Bar, Stanford University, CA
TE1 Analog Versus DSP for Disk Drives
Moderator: Richard Spencer, UC Davis, Davis, CA
Co-Organizers: Patrick Tucci, National Semiconductor, Santa Clara, CA / Tyson Tuttle, Broadcom Corp, Irvine, CA
Panel:
TE2 RF Designers are from Mars, Analog Designers are from VenusJeffrey Sonntag, Bell Labs, Lucent Technologies, Allentown, PA Richard Carley, Carnegie Mellon Univ., Pittsburgh, PA Maurizio Zuffada, SGS-Thomson Microelectronics, Milan, Italy Greg Winner, SSI, Tustin, CA Hemant Thapar, DataPath Systems, Santa Clara, CA Jerrell Hein, Crystal Semiconductor Corp., Austin, TX Matsuju Yoshida, Fujitsu VLSI Ltd., Aichi, Japan
Moderator / Organizer: Behzad Razavi, UCLA, Los Angeles, CA
Co-organizer: Hae-Seung Lee, MIT, Cambridge, MA
Panel:
TE3 Multimedia Networking: Wireless, Cable or Telco?Asad Abidi, UCLA, Los Angeles, CA Les Besser, Besser Associates, Los Altos, CA Geoff Dawe, Analog Devices, Wilmington, MA Qiuting Huang, Swiss Fed. Inst. of Tech., Z rich, Switzerland Ed Knapp, Triquint Semiconductor, Beaverton, OR Hiroshi Kondoh, Hitachi, Tokyo, Japan
Moderator: David J. Goodman, Rutgers Univ., New Brunswick, NJ
Organizer: Lars Thon, IBM Almaden Research Center, San Jose, CA
Co-organizer: Ernesto Perea, SGS-Thomson Microelectronics, Meylan, France
Panel:
TE4 What DRAM Architecture will Succeed the Synchronous DRAM?Walter Chen, Texas Instruments, Dallas, TX John Cioffi, Stanford University, Stanford, CA Jean Jerphagnon, Alcatel Telecom, Velizy, France Denis Mestdagh, SGS-Thomson, Grenoble, France Henry Samueli, Broadcom Corporation, Irvine, CA Nori Shibata, Nippon Telephone & Telegraph, Japan Paul Shumate, Bellcore, Morristown, NJ
Moderator: Nicky Lu, Etron, Hsinchu, Taiwan, ROC
Organizer: Hyung-Kyu Lim, Samsung, Kyungi, Korea
Co-Organizer: Bill Martino, Motorola, Austin, TX
Panel:
FE5 "To Be EE or not to Be?" "Will I be Enjoying Engineering in 10 Years?"Yukio Fukuzo, NEC, Kanagawa, Japan Holger Goebel, Siemens, Munich, Germany Craig Hampel, Rambus, Mountain View, CA Chang-Hyun Kim, Samsung, Kyungki, Korea Pete MacWilliams, Intel, Hillsboro, OR Desi Rhoden, VLSI, Tempe, AZ Bill Vogley, Texas Instruments, Houston, TX
Moderator: Eric Fossum, Photobit, La Crescenta, CA
Co-Organizers: Frank Libsch, IBM Research, Yorktown Heights, NY / Fritz Kub, Naval Research Lab., Washington, DC
Panel:
FE6 Synchronous vs Asynchronous DesignPhilip Girard, Intellectual Property Attorneys, San Francisco, CA Tadashi Shibata, Tohoku University, Tokyo, Japan Rudy van de Plassche, Philips Research Labs, Eindhoven, The Netherlands Wallace Read, President of IEEE, New York, NY Eleanor Baum, Cooper Union, New York, NY Pallab Chatterjee, Texas Instruments, Dallas, TX Jim Williams, Linear Technology Corp., Milptias, CA
Moderator: Teresa Meng, Stanford University, Stanford, CA
Organizer: Engel Roza, Philips Research Labs, Eindhoven, the Netherlands
Panel:
FE7 The Future of the Net Computer and Its Impact on MicroprocessorsBob Brodersen, Univ. of California, Berkeley, CA Francky Catthoor, IMEC, Heverlee, Belgium Francois Agon, SGS-Thomson, Meylan, France Takashi Nanya, Univ. of Tokyo, Tokyo, Japan Uri Weiser, Intel Israel, Haifa, Israel, Kees van Berkel, Philips Research Labs, Eindhoven, the Netherlands
Moderator: Nick Tredennick, Tredennick Inc., Los Gatos, CA
Organizer: Jim Slager, Hitachi, San Jose, CA
Co-organizer: Vojin Oklobdzija, UC Davis, CA &Integration, Berkeley, CA
Panel:
FE8 DRAM + Logic Integration: Which Architecture and Fabrication ProcessFarid Dibachi, Diba Inc., Menlo Park, CA Harel Kodesh, Microsoft Corp., Redmond, WA John Moussouris, MicroUnity Systems Engineering Inc., Sunnyvale, CA Fred Pollack, Intel Corp., Hillsboro, OR Marc Tremblay, Sun Microsystems Inc., Mountain View, CA John Wharton, Applications Research, Palo Alto, CA
Moderator: Osamu Kimura, NEC, Sagamihara, Japan
Co-moderator: Richard Crisp, Rambus, Mountain View, CA
Organizer: Michihiro Yamada, Mitsubishi, Itami, Hyogo, Japan
Panel:
FE9 Is CMOS Ever Going to Make It in RF?Michael Nagy, SGI, Mountain View, CA Henry Lie, Hewlett Packard, Palo Alto, CA Roelof Salters, Philips, Eindhoven, the Netherlands Kenji Numata, Toshiba, Kawasaki, Japan Takao Watanabe, Hitachi, Tokoyo, Japan Kazunori Saitoh, Mitsubishi, Itami, Hyogo, Japan
Moderator / Organizer: Russ Apfel, Consultant, Austin, TX
Panel:
Robert Bayruns, Anadigics, Warren, NJ Peter Baltus, Philips Research Labs, Eindhoven, the Netherlands Paul Davis, Bell Labs, Lucent Technologies, Reading, PA Paul Gray, UC Berkeley, Berkeley, CA Gitty Nasserbakht, Texas Instruments, Dallas, TX Michiel Steyaert, Katholieke Univ. Leuven, Heverlee, Belgium Daisuke Ueda, Matsushita Electronics Corp., Osaka, Japan
TE 1 High-Density Flash Memory: Scaling or Multilevel Cell?
Moderator: Hyung-Kyu Lim, Samsung Electronics Co., Yongin, Korea
Organizer: Michihiro Yamada, Mitsubishi Electric Corp. , Itami, Japan
Panel:
TE2 Will Analog Supply Follow Digital?Greg Atwood, Intel Corp., Santa Clara, CA Daniel C. Guterman, SunDisk Corp., Santa Clara, CA Hitoshi Miwa , Hitachi, Ltd., Tokyo , Japan Jun-ichi Miyamoto , Toshiba Corp., Kawasaki , Japan Yasushi Terada, ULSI Lab, Mitsubishi Electric Corp, Itami, Japan James C. Yu, Advanced Micro Devices, Sunnyvale, CA
Moderator / Organizer: Rinaldo Castello, University of Pavia, Pavia, Italy
Panel:
TE3 Photons to Bits: Is electronic imaging at a watershed?Pietro Erratico, SGS-Thomson, Agrate Brianza, Italy Raouf Halim, Rockwell International, Los Angeles, CA Akira Matsuzawa, Matsushita Electric, Osaka, Japan Willy Sansen, Katholiecke University of Leuven, Leuven, Belgium Eric Vittoz, CSEM, Neuchatel, Switzerland Bruce Wooley, Stanford University, Stanford, CA
Moderator: H-S. Philip Wong, IBM T.J. Watson Res. Ctr, Yorktown Hts, NY
Organizer: Woodward Yang, Harvard University, Cambridge, MA
Panel:
TE 4 Computer multimedia: NSP versus DSPPeter Denyer, VLSI Vision Ltd., Edinburgh, Scotland Eric R. Fossum , JPL, Cal. Inst. of Tech. Pasadena, CA Stephen Saylor, Apple Computer Inc., Santa Clara, CA Charles G. Sodini, MIT , Cambridge, MA Nobukazu Teranishi, NEC Microelectronics Research Labs, Sagamihara, Japan Albert J.P. Theuwissen,Philips Research Labs, Eindhoven, The Netherlands
Moderator: Mehdi Hatamian, Silicon Design Experts, Morganville, NJ
Organizer: Wanda Gass, Texas Instruments, Dallas, TX
Panel:
FE5 What is the best signalling technology for memory to logic chip communications?Mike Farmwald, Chromatics Research, Mountain View, CA Gene A. Frantz, Texas Instruments, Houston, TX Matt Perry, Advanced Micro Devices,. Austin, TX Toyohiko Yoshida, Mitsubishi Electric Corp., Hyogo, Japan David Schuler, Intel Corp. , Hillsboro, OR Bill Veghte, Microsoft Corp., Redmond, WA Rob Woudsma, Philips Research Labs, Eindhoven, The Netherlands
Moderator/Organizer: Richard Crisp, Rambus, Mountain View, CA
Panel:
FE6 The Analog Top TenDavid Chapman, Motorola Semiconductor, Austin, TX Richard C. Foss, Mosaid Technologies, Kanata, Canada Terry Lee, Micron Technology, Boise, ID Tom Lee, Stanford University, Stanford, CA Rick Luebs, Hewlett-Packard, Ft. Collins, CO Masao Taguchi, Fujitsu Ltd., Kawasaki, Japan
Organizer/Moderator: Chris Mangelsdorf,Analog Devices, Wilmington, MA
Panel:
FE7 The Interconnect NightmarePaul Brokaw, Analog Devices, Wilmington, MA Max Hauser, Philips Semiconductor , Sunnyvale, CA Minoru Nagata, Hitachi Ltd., Tokyo, Japan Bob Pease, National Semiconductor, Santa Clara, CA Bang-Sup Song, Univ. of Illinois, Urbana, IL Gabor Temes, Oregon State Univ., Corvallis, OR
Moderator: Don Draper, NexGen, San Jose, CA.
Organizer: Jeff Yetter, Hewlett-Packard Co, Fort Collins, CO
Panel:
FE8 Is Capturing Network Function For ATM In Silicon Realistic?Donald A. Priore, Digital Equipment Corp., Hudson, MA Charlie X. Huang, EPIC Design Technology Inc., Santa Clara, CA Michael A. Buckley, Hewlett-Packard Co., Fort Collins, CO Yusuke Ohtomo, NTT LSI Labs, Kanagawa, Japan Jurij Paraszczak, IBM T.J. Watson Research Center Yorktown Heights NY Ahsan Bootehsaz , Synopsys, Inc., Mountain View, CA Eric P. Finchem, TriQuint Semiconductor, Inc., Beaverton, OR
Moderator: Subhash Roy, Transwittch Corp., Shelton, CT
Organizer: Ed Rathke, GTE Labs, Waltham, MA
Panel:
Rajiv Dighe, NEC USA CCRL, Princeton, NJ James Hutchins , Sandia National Labs, Livermore, CA Keiji Ishikawa, NTT LSI Labs, Kanagawa, Japan Kai-Yeung Siu, Univ. of California, Irvine, CA Mani B. Srivastava, AT&T Bell Labs, Murray Hill, NJ
WE 1 Silicon Foundries: Partners, Suppliers or Competitors? (Sunset A - C)
Moderator: Chris Rowen, MIPS Technologies, Cortaillod, Switzerland
Co-Organizers: Jean Marc Chateau, SGS-Thomson Microelectr., Grenoble, France / Marc Degrauwe, CSEM, Neuchatel, Switzerland / Frank Hewlett, Sandia National Labs, Albuquerque, NM
Panel:
WE 2 The Best DRAM Approach for Graphics Applications (Sunset D - F)James Clemens, AT&T Bell Labs, Murray Hill, NJ Leon Cloetens, Alcatel Bell, Antwerp, Belgium Alain Duteil, SGS-Thomson, Rousset, France Amnon Fisher, LSI Logic Corp., Milpitas, CA Robert Hadaway, Northern Telecom, Nepean, Canada Art Mandell, Fabless Semiconductor Corp., Sunnyvale, CA F. C. Tseng, TSMC, Hsinchu, Taiwan
Moderator: Akira Kanuma, Toshiba Corp., Kawasaki, Japan
Co-organizers: Nicky Lu, Etron Technology Inc., Hsinchu, Taiwan, R.O.C./ Richard Crisp, Rambus Inc., Mountain View, CA / Masahiko Yoshimoto, Mitsubishi Electric Corp., Itami, Japan
Panel:
WE 3 The Digital Highway: The Off Ramp to the HomeAnthony M. Balistreri, Texas Instruments, Stafford, TX Richard Crisp, Rambus Inc., CA Kazuyasu Fujishima, Mitsubishi Electric Corp., Itami, Japan T. Sunaga, IBM Japan Ltd., Shiga, Japan Dick Lawrence, Digital Equipment Corp., Hudson, MA Rajan Kapur, Cirrus Logic, Fremont, CA Takeshi Kizaki, Hitachi Ltd., Japan
Moderator/Organizer: Russ Apfel, Consultant, Austin, TX
Organizer: Yukio Akazawa, NTT LSI Laboratories, Atsugi, Japan
Panel:
WE 4 Analog BiCMOS: Luxury or Necessity?Wendell Bailey, Nat'l. Cable Television Assoc., Washington, DC David Ehreth, DSC Communications Corp., Petaluma, CA Oswald Fundneider, Siemens AG, Munich, Germany Robert Luff, Scientific Atlanta, Norcross, GA Paul Shumate, Bellcore, Morristown, NJ Kazuo Yamaguchi, Fujitsu LTD, Japan
Moderator
Co-organizers: Behzad Razavi, AT&T Bell Labs, Holmdel, NJ / Robert Jewett, Hewlett Packard Labs, Palo Alto, CA
Panel:
TE 5 In-House CAD versus Vendor CAD for High-Performance ProcessorsKlaas Bult, UCLA, Los Angeles, CA Bill Krenik, Manager, TI, Dallas, TX Mark McDonald, National Semiconductor, Santa Clara, CA Davis Robertson, Analog Devices, Wilmington, MA Michiel Steyaert, Katholieke Universiteit Leuven, Heverlee, Belgium Eric Swanson, Crystal Semiconductor, Austin, TX Kazua Sone, NEC, Tokyo, Japan
Organizer: Ted Williams, HaL Computer Systems, Campbell, CA
Moderator: Patrick Bosshart, Texas Instruments, Dallas, TX
Panel:
TE 6 Single-Chip Integration versus Multichip ModulesAnant Agrawal, Sun Microsystems, Mountain View, CA Gil Amid, Intel Design Center, Haifa, Israel William Grundmann, Digital Equipment Corp., Hudson, MA Wally Rhines, Mentor Graphics Corp., Wilsonville, OR Matthew Rohm, Silicon Graphics Inc., Mountain View, CA James Solomon, Cadence Design Systems, San Jose, CA
Moderator: Stephen Flannagan, Motorola, Austin, TX
Panel:
TE7 Radio Front-End and Digital Signal Processing: Incompatible Technologies or Incompatible People?van Davidson, IBM, Poughkeepsie, NY Paul Franzon, North Carolina State Univ., Raleigh, NC Kasuro Sasaki, Hitachi America, San Jose, CA Frank Swiatowiec, Micromodule Systems, Cupertino, CA Masahide Takada, NEC Microelectronics, Kanagawa, Japan
Moderator / Organizer: Matt Rhodes, PCSI, San Diego
Panel:
TE 8 Monolithic Surface-Micromachined Sensors: IC Technology of the Next Century?Asad A. Abidi, University of California, Los Angeles, CA Peter Baltus, Philips Research Labs, Eindhoven, The Netherlands Ricke Clark, Rockwell International, Newport Beach, CA Joseph Fenk, Siemens AG, Munich, Germany Gene Frantz, Texas Instruments, Dallas, TX Masayuki Ishikawa, NTT LSI Labs, Atsugi, Japan Mehmet Soyuer, IBM T.J. Watson Research Ctr.
Moderator: Richard Payne, Analog Devices, Wilmington, MA
Organizer: Bernhard Boser, Dept. of EECS, Univ. of California, Berkeley, CA
Panel: