ISSCC Author Information

IEEE International Solid-State Circuits Conference

2004 ISSCC

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ISSCC 2004 Acceptance Packages Available

The ISSCC 2004 author acceptance packages are available on the Mira submission website. A copy of the Acceptance Package, ISSCC Glossary of Abbreviations for Authors, Student Financial Assistance information, and Visuals Instructions are included below for your convenience.

Visuals Instructions - (PDF)

Author Acceptance Package - (PDF)
ISSCC Glossary of Abbreviations for Authors - (PDF)
Student Financial Assistance - (RTF)

If you have any comments for the ISSCC, please forward them to
Frank Hewlett
hewletfw@sandia.gov

http://www.isscc.org/isscc/2004/authors.htm is maintained by sscs@eecg.toronto.edu
Last modified : Friday October 31, 2003 at 10:26pm EST