SESSION
TA 11
SALON
10-15,
Tues,
8
8:30
AM
INTEGRATED
SENSORS AND DISPLAY CIRCUITS
Chair:
A. Akinwande, Massachusetts Inst. of Technology,
Cambridge,
MA
Associate
Chair: D. McGrath, Atmel Corp., Andover, MA
11.1 A
CMOS Ultrasound Range-Finder Microsystem
8:30
AM
C.
Kuratli, Q. Huang
Swiss
Federal Inst. of Technology (ETH), Zurich, Switzerland
A
miniaturized ultrasound range finder in standard 0.8
um
CMOS uses thermally-excited silicon membrane transducers to generate or detect
ultrasound at 100kHz. The distance sensor is based on a quasi-continuous
measurement requiring coherent ultrasound waves delivered by an
electro-mechanical PLL. Accuracy is 3mm.
11.2 An
Opto-Electronic 18b/Revolution Absolute
Angle
and Torque Sensor for
Automotive
Steering Applications
9:00
AM
A.
Mortara, P. Heim, E. Franzi, P-F. Ruedi, P. Masa, F. Heitger,
J.
Baxter
1
Centre
Suisse d'Electronique et de Microtechnique S.A.,
Neuchâtel,
Switzerland
1Bishop
Innovation Pty. Ltd., North Ryde, New S. Wales, Australia
An
ASIC computes torque and absolute position for power-assisted vehicle steering
using light reflected off optically-encoded patterns etched on an elastic
two-cylinder assembly. The ASIC uses Fourrier analysis and parallel processing
to determine 11b-accurate absolute and 7b-accurate relative positions.
Sub-pixel resolution and and torque measurements at rotation up to 4k
deg./s
are achieved.
11.3 Integrated
Circuits for Particle Physics Experiments in the 21st Century
9:30
AM
W.
Snoeys, M. Campbell, E. Heijne, A. Marchioro
CERN,
Geneva, Switzerland
Electronics
requirements for high-energy physics experiments are described. A readout IC
for a pixel detector consists of tens of millions of channels, with up to 8k
channels per chip. Each channel detects <1fC (~6000e) with 25ns timing at
<100
uW/channel.
Layout makes prototype in 0.25
um
CMOS tolerant to 30Mrad.
BREAK 10:00
AM
11.4 Remote
CMOS Pressure-Sensor Chip with Wireless Power and Data Transmission
10:15 AM
T.
van den Boom, D. Tessmann, R. Lerch, G. von Bögel,
D.
Hammerschmidt, J. Amelung, B. Hosticka
Fraunhofer
Institute of Microelectronic Circuits and Systems,
Duisburg,
Germany
A
single-chip wireless pressure-sensor system contains on-chip capacitive
pressure arrays, temperature sensor, voltage reference, SC 10b cyclic ADC,
controller, EEPROM and ASK multi-tag RF transponder (133kHz). Carrier power is
used for batteryless operation up to 1m distance. The chip is 15mm
2
in 1.5
um
CMOS and consumes <180
uW
during measurement.
11.5 A
3.8inch QVGA Reflective Color LCD with
Integrated
3b DAC Driver
10:45 AM
Y.
Nakajima, N. Goto, H. Kataoka, T. Maekawa
Sony
Corp., Atsugi, Kanagawa, Japan
A
reflective color 320x240 pixel LCD with integrated 3b digital-to-analog
converter (DAC) has built-in circuits including sampling, latch and DAC using
low temperature poly-Si TFTs. It dissipates 15mW and has a narrow edge-frame,
giving 81% display area.
11.6 A
CMOS Analog Front-End Chip-Set for
Mega-Pixel
Camcoders
11:15 AM
K.
Nakamura, S. Decker, D. Kelly, D. Das, L. St. Onge, I. Mehr,
M.
Walsh, E. Swanson, P. Picano, C. Mangelsdorf
1,
H. Yamaguchi
1,
K.
Nishio
2,
T. Senda
2
Analog
Devices, Wilmington, MA
1Analog
Devices Japan Design Ctr., Tokyo, Japan
2Sony
Corp., Tokyo, Japan
A
33MHz analog chip-set for integrating video-rate CCDs consists of a
transmit-side of correlated double sampling and a receive-side of 9b
programmable-gain amplifier/10b ADC. A chip set in 0.35
um
CMOS shows 74dB S/N, 4-22dB gain range and 115mW combined power from 2.8V
supply. The chip-set is used in a 1.07M-pixel DV camcorder with 520-line
resolution.
11.7 An
Embeddable Low-Power SIMD Processor Bank
11:30
AM
S.
Hong, W. Yang
Harvard
Univ., Cambridge, MA
A
low-power SIMD processor architecture suitable for embedding with CMOS
imagers/frame buffer is capable of real-time video compression. The prototype
processor array and streaming data buffer are matched to 9.6
um
pixel pitch and have 20mW peak consumption at 25MHz and 2.5V.
CONCLUSION 11:45
AM