Sensors, Imagers, & Displays
- Daytime Paper Sessions
- Evening Panel Discussion
- Tutorial
1998 ISSCC - SENSORS AND IMAGERS
Subcommittee Chair:
Dennis L. Polla, University of Minnesota, Minneapolis, MN.
HIGHLIGHTS
- A renewed interest in image sensors shows innovative chips with smaller pixels, higher resolution, and higher systems integration. [FA11]
- A universal sensor/transducer-interface single chip (for the P1451 standard) has been demonstrated [SA17]
MOST- SIGNIFICANT RESULTS
- Imagers are being widely developed in CMOS technology with higher levels of integration for virtual reality and Internet conferencing. [11.1, 11.8]
- A large-area (>10cm2), inexpensive CMOS imager for dental x-rays has been commercialized. [11.3]
- A micropower gas-flow measurement system has been demonstrated for gas meters [17.4]
- Fingerprint-recognition chips have been realized and are being commercialized [17.7]
APPLICATIONS
- DNA-probe microchips offer new opportunities in providing better health care through gene therapy [17.1]
- Inexpensive digital cameras, dental X-ray imaging [11.3]
- Fingerprint-identifications systems for internet commerce [17.7]
ECONOMIC AND SOCIAL IMPACT
- Biometric identification (fingerprints, DNA, and dental X-rays)
- Proliferation of multi-media, video conferencing, image-based communication
PANEL
- Will CMOS Image Sensors Survive Scaling? [FE5]
TUTORIAL
- MEMS for the Circuit Designer [T5]
Session:
FA11 Subcommittee: Sensors AND Imagers
Image Sensors
Chair:
H.-S. Philip Wong, IBM T.J. Watson Research Center, Yorktown Heights, NY.
Associate Chair:
Fritz Kub, Naval Research Laboratory, Washington, DC.
DRIVERS
- Smaller pixel size
- Higher levels of functional integration on-chip
- Improvement in sensitivity and dynamic range
- Lower power consumption
HIGHLIGHTS
- Color camera on a chip [11.1, 11.2]
- Functional integration on-chip [11.3]
- Improved sensitivity and dynamic range [11.4,11.5]
- Smaller pixel sizes [11.6,11.7,11.8]
Session:
SA17 Subcommittee: Sensors AND Imagers/ Technology Directions
Sensor Technology
Chair:
Michael G. Knoll, Sandia National Laboratories, Albuquerque, NM.
Associate Chair:
Atsushi Iwata, Hiroshima University, Higashi-Hiroshima, Japan.
DRIVERS
- Higher Levels of Functional Integration On-Chip
- Reduced Power
- New Technology Directions
- Integration of Sensor and Interface Circuits on Same Chip
HIGHLIGHTS
- First Integrated P1451 Standard Transducer Interface IC [17.3]
- Low Power (16uA) Gas-Flow Interface Circuit [17.4 ]
- New Giant Magnetoresistive Current-Isolation Circuit [17.5]
- Improved Direct-Contact Fingerprint Sensor [17.7]
Panel Session
:FE5 Subcommittee: Sensors AND imagers
Will CMOS Imagers Survive Scaling?
OBJECTIVE
- Identify technical challenges of continued scaling of CMOS image sensors, particularly in sub 0.25 micron technologies
APPLICATIONS
- A large variety of growing video applications including camera-on-a-chip
CHALLENGES
- Degradation of photodetector performance due to lower quantum efficiencies and higher dark currents
- Fabrication of photodetectors in SOI
CONTROVERSIES
- Integration of photodetectors with submicron CMOS
- Compatibility of image sensors with DRAM processes
- Compatibility of image sensors with SOI
- Vertical integration of photodetectors with CMOS
Tutorial
: T5 Subcommittee: Sensors AND imagers
MEMS for the Circuit Designer
Khalil Najafi & William Kaiser
OVERVIEW
- Basic principles and applications of solid-state micromachining for MEMS are presented.
- An overview of common MEMS interface circuits is presented.
- Technology constraints and opportunities for the MEMS circuit designer are described.
- Applications of MEMS including RF communication devices, microptical systems, and biomedical systems are described.
TUTORIAL SPEAKER BIOGRAPHY
Khalil Najafi
received the PhD in EE from University of Michigan in 1986. His research areas include MEMS, interface circuits, micromachining technology, telemetry circuits, and implantable biomedical microsystems. He is Associate Professor of EECS at University of Michigan.
William Kaiser, Chairman of the UCLA EE Dept., received the PhD in Solid-State Physics from Wayne State University in 1984. His research includes development of automotive sensors and inertial microsensors. His group has demonstrated microgyroscope interface circuits, and micropower weak-inversion CMOS RF systems, and microsensor DSP systems.
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Last modified : Tuesday February 17, 1998 at 8:12am EST