DISCUSSION SESSIONS

FE7 - LSI Solutions and Enabling Technologies for Mobile Multimedia Devices at the Year 2002. -- (Salon 8)

Organizer: K. Sasaki, Hitachi Central Research Labs., Tokyo, Japan
Coorganizer: T. Baba, Matsushita Semiconductor of America, Palo Alto, CA
T. Sumi, MatsushitaElectronics Corp., Osaka, Japan
Moderator: T. Meng, Stanford University, Stanford, CA

Future handheld device issues include whether the device is tailored to a PC, a phone, or a PDA. Taking price and size/weight into account, what is essential among functions such as voice, data, image, and video? Each panelist will predict two handheld devices describing feature, size, and price in 2002. LSI solutions for the devices are crucial for cost, performance, and power dissipation. Continuous advancement of CMOS technology to 0.1um and beyond will permit the integration of the digital, analog, memory peripherals in one chip. Panelists will propose optimum LSI solutions for their handheld devices in terms of price and performance. The one-chip solution may be possible but may not be the best solution.

Panel:


R. Brodersen, UC Berkeley, CA
C. Chien, Rockwell Science Center, Thousand Oaks, CA
S. Kawasaki, Hitachi Microsystems Inc., San Jose, CA
T. Lee, Stanford University, CA
H. Meyr, Aachen University, Templergraben, Germany
M. Motomura, NEC, Kanagawa, Japan
W. Sansen, Katholieke Universiteit Leuven, Belgium


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