TE 1 High-Density Flash Memory: Scaling or Multilevel Cell?
Moderator: Hyung-Kyu Lim, Samsung Electronics Co., Yongin, Korea
Organizer: Michihiro Yamada, Mitsubishi Electric Corp. , Itami, Japan
The multilevel cell (MLC) concept has recently been introduced for flash memory technologies. Although the MLC has the potential to reduce cost, its use may degrade performance. A panel composed of experts representing various flash cell technologies will examine the feasibility of the MLC and its potential for success in the marketplace. The panel will compare the scalability of the various cell structures and the resulting die areas and will debate these approaches to determine which best serves future high-density flash market requirements.
Panel: Greg Atwood, Intel Corp., Santa Clara, CA
Daniel C. Guterman, SunDisk Corp., Santa Clara, CA
Hitoshi Miwa , Hitachi, Ltd., Tokyo , Japan
Jun-ichi Miyamoto , Toshiba Corp., Kawasaki , Japan
Yasushi Terada, ULSI Lab, Mitsubishi Electric Corp, Itami, Japan
James C. Yu, Advanced Micro Devices, Sunnyvale, CA
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