A spot-measurement system uses 650 photodetectors formed in a 2mm CMOS process. The 2.5x2.7mm2 chip sensitivity is 0.6-1.0V/decade over the 1W/m2 to 2kW/m2 red light-intensity range. The fixed-pattern noise is 10% and response time is 10-20ms.

9.2 Integrated Analog Sensor for Automatic Alignment (9:00)

An integrated photodiode system detects the image of a surveyor's mark with current amplifiers providing an x-y error signal independent of illumination level. The 36mm2 BiCMOS circuit resolves 400steps/mm and achieves 0.1% position accuracy with 7.5kHz maximum bandwidth. The chip is used in optical alignment systems.

9.3 A CMOS Chip-set for Detecting 10ppb Concentrations of Heavy Metal Ions (9:30)

Two CMOS ASICs simultaneously detect Pb, Cu, Cd, and Zn ions in water. The 5.1x3.5mm2 sensor chip provides temperature, pH, and ion concentration measurements, with an ion-concentration resolution of 10ppb. The 5.1x5.6mm2 control chip includes a 14b ADC, a 10b DAC, and dissipates 50mW.

9.4 A Monolithic Surface-Micromachined Accelerometer with Digital Output (10:00)

A monolithic surface-micromachined z-axis accelerometer with electrostatic force-feedback and an on-chip A/D converter achieves a 50dB dynamic range measured in a 50Hz bandwidth with a ±5g input range. The active die area, including the 400x400mm2 sensor, is 3mm2.

Break (10:30)

9.5 A Programmable Mixed-Signal ASIC for Data-Acquisition Systems in Medical Implants (10:45)

A data-acquisition ASIC for medical implants is composed of a microcontroller and three programmable analog channels. The 85mm2 die with 75k transistors fabricated in 1.6mm CMOS operates from 2.5 to 5V. 1mV/Hz½ equivalent channel input noise is obtained with 3.9mW power dissipation.

9.6 Surface Micromachining: From Vision to Reality to Vision (11:15)

The philosophy and development of micromachined polysilicon transducers integrated with 3mm BiCMOS is presented. A 50g force-balanced airbag accelerometer with full on-chip signal processing and self-test is realized. Future technology applications _include multi-axis accelerometers, gas flow sensors, and building blocks such as clocks, resonators, and filters.

9.7 A Micromachined Low-Power Temperature-Regulated Bandgap Voltage Reference (11:45)

Thermally- and electrically-isolated single-crystal silicon islands micromachined in standard CMOS chips form a bandgap voltage reference. Temperature coefficient is 9ppm/°C. The reference has 53,000°C/W thermal resistance, 2.5ms thermal time constant, and dissipates 1.5mW at 25°C.

Conclusion (12:00)

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